System and method for allowing restoration of first interconnection of die of power module
AssigneeMitsubishi Electric Corporation
InventorsJeffrey Ewanchuk, Julio Brandelero, Stefan Mollov
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Abstract
The present invention concerns a system for allowing the restoration of a first interconnection of a die of a power module connecting the die to an electric circuit. The system comprises: at least one other interconnection of the power module, a periodic current source that is connected to the at least one other interconnection for generating a periodic current flow through the at least one other interconnection in order to reach, in at least a part of the first interconnection, a predetermined temperature during a predetermined time duration. The present invention concerns also the associated method.
Claims10
A system for allowing the restoration of a first interconnection of a die of a power module connecting the die to an electric circuit, characterized in that the system comprises:
- at least one other interconnection of the power module,
- a periodic current source that is connected to the at least one other interconnection for generating a high frequency periodic current flow through the at least one other interconnection in order to reach, in at least a part of the first interconnection, a predetermined temperature during a predetermined time duration in order to allow the restoration of the first interconnection by increasing the first interconnection temperature and by increasing the pressure along crack in the first interconnection and thereby increasing a rate of diffusion in cracks causing the crack to heal and wherein the interconnections are bond wires or the interconnections are copper vias, the periodic current source is connected to two other interconnections and the power module further comprises one induction coil that is connected to the two interconnections in order to reach, in at least a part of the first interconnection, the predetermined temperature during the predetermined time duration or the power module further comprises one magnetic structure that is connected to the two interconnections in order to reach, in at least a part of the first interconnection, the predetermined temperature during the predetermined time duration.
A method for allowing the restoration of a first interconnection of a die of a power module connecting the die to an electric circuit, characterized in that the method comprises the steps of:
- providing a high frequency periodic current source to at least one other interconnection of the power module for generating a periodic current flow through the at least one other interconnection in order to reach, in at least a part of the first interconnection, a predetermined temperature,
- controlling the periodic current flow at the predetermined temperature during a predetermined time duration in order to allow the restauration of the first interconnection by increasing the first interconnection temperature and by increasing the pressure along crack in the first interconnection and thereby increasing a rate of diffusion in cracks causing the crack to heal and wherein that the interconnections are bond wires or the interconnections are copper vias, the periodic current source is connected to two other interconnections and the power module further comprises one induction coil that is connected to the two interconnections in order to reach, in at least a part of the first interconnection, the predetermined temperature during the predetermined time duration or the power module further comprises one magnetic structure that is connected to the two interconnections in order to reach, in at least a part of the first interconnection, the predetermined temperature during the predetermined time duration.
Dependencies are inferred from the claim text.