Wafer processing method
AssigneeDisco Corporation
InventorRyuji Norimoto
Life of this patent
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Abstract
A wafer processing method is a method of dividing a wafer in which a functional layer is laminated to a top surface of a substrate and a plurality of devices are formed, along streets dividing the plurality of devices. The wafer processing method includes: a protective member disposing step of disposing an adhesive tape on the functional layer side of a top surface of the wafer; a cutting step of forming, along the streets, a cut groove having a depth exceeding a finished thickness of the wafer by making a cutting blade cut into an undersurface of the wafer; and a plasma etching step of extending the cut groove toward the top surface of the wafer and dividing the substrate along the streets by plasma-etching, from an undersurface side, the wafer whose adhesive tape side is held by a chuck table.
Claims13
A wafer processing method for dividing a wafer having streets demarcating a plurality of devices, the wafer processing method comprising:
- a step of providing a substrate having a first surface and an opposing second surface, and a functional layer laminated to the first surface;
- a disposing step of disposing a protective member on the functional layer on the first surface of the substrate;
- a cutting step of forming, along the streets, a cut groove having a depth exceeding a finished thickness of the wafer by making a cutting blade cut into the second surface of the substrate;
- and
- a plasma etching step of extending the cut groove from a bottom surface of the cut groove to the functional layer on the first surface of the substrate to divide the substrate along the streets without dividing the functional layer, wherein in the plasma etching step, plasma etches the second surface in addition to the bottom surface of the cut groove.
Dependencies are inferred from the claim text.