# US 11,114,322 B2 · Mold and transfer molding apparatus

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- Number: US 11,114,322 B2
- Document ID: US11114322B2
- Status: Granted
- Kind: B2
- Application number: 15/455,475
- Filed: 2017-03-10
- Published: 2017-09-21
- Granted: 2021-09-07
- Earliest claimed: 2016-03-16
- Assignees: Toshiba Memory Corporation
- Applicants: Toshiba Memory Corporation
- Inventors: Takeori Maeda; Ryoji Matsushima; Makoto Kawaguchi; Masaaki Wakui
- Web page: https://patentgrep.com/patent/US11114322B2

## CPC

- B29C 45/76: Measuring, controlling or regulating {(measuring in general G01; controlling or regulating in general G05)}
- H10P 72/0606: {Position monitoring, e.g. misposition detection or presence detection}
- B29C 45/02: Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
- B29C 45/03: Injection moulding apparatus (transfer moulding B29C45/02)
- B29C 45/14065: {Positioning or centering articles in the mould}
- B29C 45/14336: {Coating a portion of the article, e.g. the edge of the article (B29C45/14573 and B29C45/14598 take precedence)}
- B29C 45/34: having venting means
- B29C 45/77: of velocity or pressure of moulding material
- B29C 45/78: of temperature
- B29C 45/80: of relative position of mould parts
- H10P 72/0602: {Temperature monitoring}
- H10P 72/7606: {characterised by edge clamping, e.g. clamping ring}
- B29C 45/14655: {connected to or mounted on a carrier, e.g. lead frame}
- B29C 45/2708: {Gates (B29C45/2703 takes precedence)}
- B29C 2045/14155: {using vacuum or suction}
- B29C 2945/76006: Pressure
- B29C 2945/7604: Temperature
- B29C 2945/76083: Position
- B29C 2945/7618: Injection unit
- B29C 2945/76254: Mould
- B29C 2945/76287: Moulding material
- B29C 2945/76568: Position
- B29L 2031/34: Electrical apparatus, e.g. sparking plugs or parts thereof
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.

## Claims

### Claim 1

A transfer molding apparatus, comprising:
a mold;
a transfer part introducing a resin to the mold, and the transfer part configured to be movable between an initial position and a post-movement position; and
a sensor,
the mold including
a substrate clamping surface contacting a surface of a processing substrate;
a cavity recessed from the substrate clamping surface;
a suction part recessed from the substrate clamping surface;
a vent being provided on a path between the cavity and the suction part, communicating with the cavity, being recessed from the substrate clamping surface to a vent depth, and being used as an exhaust path of a gas inside the cavity;
an intermediate cavity being provided between the vent and the suction part on the path, communicating with the vent, and being recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth; and
an shut-off pin opening and closing the path and being provided between the intermediate cavity and the suction part on the path,
the transfer part filling the resin into the cavity in an open state of the shut-off pin,
the sensor positioned between an input of the vent and the intermediate cavity and sensing that at least a portion of the resin has passed through the vent and reached at least a portion of the intermediate cavity,
the shut-off pin being set to a closed state after the sensing by the sensor.

### Claim 2 (depends on 1)

The apparatus according to claim 1, wherein
the sensing by the sensor includes at least one of:
sensing, at a path between the transfer part and the cavity, at least one of a temperature of the mold, a pressure of the resin, reflected light at the mold, or reflected light at the processing substrate;
sensing, at the path between the cavity and the suction part, at least one of a temperature of the mold, a pressure of the resin, reflected light at the mold, or reflected light at the processing substrate; or
sensing a position of the transfer part.

### Claim 3 (depends on 1)

The apparatus according to claim 1, wherein
the sensing by the sensor includes
sensing, at a path between the transfer part and the cavity, at least one of a temperature of the mold, a pressure of the resin, reflected light at the mold, or reflected light at the processing substrate.

### Claim 4 (depends on 1)

The apparatus according to claim 1, wherein
the sensing by the sensor includes
sensing, at the path between the cavity and the suction part, at least one of a temperature of the mold, a pressure of the resin, reflected light at the mold, or reflected light at the processing substrate.

### Claim 5 (depends on 1)

The apparatus according to claim 1, wherein
the sensing by the sensor includes
sensing a position of the transfer part.

### Claim 6 (depends on 1)

The apparatus according to claim 1, comprising:
at least two intermediate cavities,
the shut-off pin including multiple shut-off pins, a first shut-off pin positioned at a first position and a second shut-off pin positioned at a second position,
the first position being provided between one of the intermediate cavities and the suction part on the path,
the second position being provided between another of the intermediate cavities and the suction part on the path,
the sensor sensing that at least a portion of the resin has reached at least a portion of the one of the intermediate cavities or the another of the intermediate cavities,
the first position or the second position being set to a closed state after the sensing by the sensor.

### Claim 7 (depends on 1)

The apparatus according to claim 1, wherein
the mold including a gate being recessed from the substrate clamping surface to a gate depth,
the cavity being provided at least a part between the vent and the gate,
the vent depth being shallower than the gate depth.