Wafer level mold chase
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wen Liu, Po-Hao Tsai, Yi-Wen Wu, Shin-Puu Jeng
Life of this patent
Estimating the term…
Abstract
A mold chase is provided, including a lower mold support and an upper mold support which are configured to be pressed together to form a mold cavity therebetween for receiving a wafer level substrate. The mold chase also includes multiple gates and at least one vent disposed along the periphery of the mold cavity. The gates are configured to allow a mold material to be injected into the mold cavity, and the vents are configured to release gas from the mold cavity. The distance between one of the gates and the closest vent is less than the diameter of the mold cavity.
Claims20
A mold chase, comprising:
- a lower mold support;
- an upper mold support, wherein the upper mold support and the lower mold support are configured to be pressed together to form a mold cavity therebetween for receiving a wafer level substrate;
- a plurality of gates disposed along a periphery of the mold cavity and configured to allow a mold material to be injected into the mold cavity;
- at least one vent disposed along the periphery of the mold cavity and configured to release gas from the mold cavity;
- a plurality of trenches formed on the upper mold support and arranged along the periphery of the mold cavity, configured to communicate the mold cavity with the at least one vent;
- a shutter pin configured to control the opening and closing of the trenches;
- and
- a storage tank formed between the shutter pin and the at least one vent and configured to collect the mold material from the mold cavity;
- wherein a distance between one of the gates and the closest vent is less than a diameter of the mold cavity.
A mold chase, comprising:
- a lower mold support;
- an upper mold support, wherein the upper mold support and the lower mold support are configured to be pressed together to form a mold cavity therebetween for receiving a wafer level substrate;
- a gate formed in a central region of the upper mold support and configured to allow a mold material to be injected into the mold cavity;
- and
- a plurality of vents disposed along a periphery of the mold cavity and configured to release gas from the mold cavity;
- a plurality of trenches formed on the upper mold support and arranged along the periphery of the mold cavity, configured to communicate the mold cavity with each of the vents;
- a shutter pin configured to control the opening and closing of the trenches;
- and
- a storage tank formed between the shutter pin and the respective vent and configured to collect the mold material from the mold cavity;
- wherein a distance between the gate and one of the vents is less than a diameter of the mold cavity.
A mold chase, comprising:
- a lower mold support;
- an upper mold support, wherein the upper mold support and the lower mold support are configured to be pressed together to form a mold cavity therebetween;
- a gate disposed on a side of the mold cavity and configured to allow a mold material to be injected into the mold cavity;
- a vent disposed on another side of the mold cavity opposite the gate and configured to release gas from the mold cavity;
- a plurality of trenches formed on the upper mold support and arranged along a periphery of the mold cavity to communicate the mold cavity with the vent, wherein the plurality of trenches is located between the mold cavity and the vent;
- a shutter pin configured to control the opening and closing of the trenches;
- and
- a storage tank formed on the lower mold support between the shutter pin and the vent and configured to collect the mold material from the mold cavity.
Dependencies are inferred from the claim text.