# US 11,114,312 B2 · Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,114,312 B2 - Document ID: US11114312B2 - Status: Granted - Kind: B2 - Application number: 16/394,925 - Filed: 2019-04-25 - Published: 2019-08-15 - Granted: 2021-09-07 - Earliest claimed: 2017-01-03 - Assignees: STMicroelectronics (Grenoble 2) SAS - Applicants: STMicroelectronics (Grenoble 2) SAS - Inventors: Benoit Besancon; Alexandre Mas; Karine Saxod - Web page: https://patentgrep.com/patent/US11114312B2 ## CPC - H10W 74/016: {using moulds} - H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control - H10W 40/778: {in encapsulations} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 72/071: {Connecting or disconnecting} - H10W 74/124: {the encapsulations having cavities other than that occupied by chips} - H10W 74/147: {the encapsulations being multilayered} - H10W 76/12: characterised by their shape - H10W 76/15: Containers comprising an insulating or insulated base - H10W 76/17: characterised by their materials - H10W 76/47: Solid or gel fillings - H10W 76/60: Seals - H10W 99/00: Subject matter not provided for in other groups of this subclass - H10W 72/0198: {batch processes} - H10W 72/884: {Die-attach connectors and bond wires} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover. ## Claims ### Claim 1 A method for manufacturing, comprising the following steps: placing at least one insert having opposite faces in a cavity of a mold having opposite surfaces, said insert positioned such that at least part of one of the opposite faces of the insert makes contact with at least part of one of the opposite surfaces of the mold; injecting a coating material into said cavity; and setting the coating material in order to obtain an overmolded substrate within which said insert is at least partly included to form an encapsulation cover comprising the at least one insert and at least a portion of said overmolded substrate. ### Claim 2 (depends on 1) The method according to claim 1, further comprising cutting through said overmolded substrate at a distance from said insert. ### Claim 3 (depends on 1) The method according to claim 1, further comprising placing at least part of another one of the opposite faces of said insert in contact with at least part of another one of the opposite surfaces of said mold. ### Claim 4 (depends on 1) The method according to claim 1, further comprising positioning at least one layer made of a compressible material along at least one of said opposite surfaces of said mold with the face of the insert in contact with the layer of compressible material. ### Claim 5 (depends on 1) The method according to claim 1, where one of said opposite surfaces of the mold comprises at least one zone surrounded by at least one groove, the injected coating material filling said groove so that said overmolded substrate includes at least one protruding ring-shaped rib corresponding to said groove of the mold. ### Claim 6 (depends on 5) The method according to claim 5, further comprising cutting through said overmolded substrate and said protruding ring-shaped rib. ### Claim 7 A method for manufacturing, comprising the following steps: placing at least one insert having opposite faces in a two-part mold having a first part and a second part defining a cavity, the first and second parts having opposite surfaces, said insert positioned such that at least part of one of the opposite faces of the insert makes contact with at least part of one of the opposite surfaces of the two-part mold; injecting a coating material into said cavity; and setting the coating material in order to obtain an overmolded substrate that at least partly overmolds said insert to form an encapsulation cover comprising the at least one insert and at least a portion of said overmolded substrate. ### Claim 8 (depends on 7) The method according to claim 7, further comprising cutting through said overmolded substrate at a distance from said insert. ### Claim 9 (depends on 7) The method according to claim 7, further comprising placing at least part of another one of the opposite faces of said insert in contact with at least part of another one of the opposite surfaces of said mold. ### Claim 10 (depends on 7) The method according to claim 7, further comprising positioning at least one layer made of a compressible material along at least one of said opposite surfaces of said mold with the insert in contact with the layer of compressible material. ### Claim 11 (depends on 7) The method according to claim 7, where one of said opposite surfaces of the mold comprises at least one zone surrounded by at least one groove, the injected coating material filling said groove so that said overmolded substrate includes at least one protruding ring-shaped rib corresponding to said groove of the mold. ### Claim 12 (depends on 11) The method according to claim 11, further comprising cutting through said overmolded substrate and said protruding ring-shaped rib. ### Claim 13 A method for manufacturing, comprising the following steps: placing a plurality of inserts, each insert having opposite faces, in spaced apart positions within a two-part mold having a first part and a second part defining a cavity, the first and second parts have opposite surfaces, said insert positioned such that at least part of one of the opposite faces of the insert makes contact with at least part of one of the opposite surfaces of the two-part mold; injecting a coating material into said cavity; setting the coating material in order to obtain a set coating material providing a substrate that at least partly overmolds said plurality of inserts to form an overmolded structure; and dicing the overmolded structure at locations between inserts to form a plurality of encapsulation covers, wherein each encapsulation cover comprises at least one insert and at least a portion of the set coating material. ### Claim 14 (depends on 13) The method according to claim 13, further comprising placing at least part of another one of the opposite faces of each insert in contact with at least part of another one of the opposite surfaces of said mold. ### Claim 15 (depends on 13) The method according to claim 13, further comprising positioning at least one layer made of a compressible material along at least one of said opposite surfaces of said mold with the inserts in contact with the layer of compressible material. ### Claim 16 (depends on 13) The method according to claim 13, where one of said opposite surfaces of the mold comprises a plurality of zones with each zone surrounded by a groove, the injected coating material filling said groove so that said overmolded structure includes a protruding ring-shaped rib corresponding to said groove of the mold. ### Claim 17 (depends on 13) The method according to claim 13, wherein dicing further comprises cutting through said protruding ring-shaped rib.