Controlling of height of high-density interconnection structure on substrate
AssigneeInternational Business Machines Corporation
InventorsKeishi Okamoto, Akihiro Horibe, Hiroyuki Mori
Life of this patent
Estimating the term…
Abstract
An interconnection layer carrying structure for transferring an interconnection layer onto a substrate is disclosed. The interconnection layer carrying structure includes a support substrate, a release layer on the support substrate; and an interconnection layer on the release layer. The interconnection layer includes an organic insulating material and a set of pads embedded in the organic insulating material. The set of the pads is configured to face towards the support substrate. The support substrate has a base part where the interconnection layer is formed and an extended part extending outside the base part.
Claims24
A method for fabricating an interconnection layer carrying structure used for transferring an interconnection layer onto a substrate, the method comprising:
- applying a release layer onto a support substrate;
- building a set of pads on the release layer;
- forming an organic insulating material layer over and above the set of the pads, the organic insulating material layer being formed within a predefined area on the support substrate, wherein the organic insulating material layer overlays a base part of the support substrate corresponding to the predefined area and an extended part of the substrate laterally beyond the predefined area is free from the organic insulating material layer;
- and
- building a plurality of traces on the organic insulating material layer.
A method for fabricating an interconnection substrate used for interconnecting chips mounted thereon using an interconnection layer carrying structure, the interconnection layer carrying structure comprising an interconnection layer, a release layer on the interconnection layer and a support substrate on the release layer, the interconnection layer comprising an organic insulating material and a set of pads embedded in the organic insulating material, the set of the pads being configured to face towards the support substrate, the support substrate having a base part where the interconnection layer is formed and an extended part extending outside the base part, the method comprising:
- preparing a base substrate provided with a first group of electrodes for a first chip and a second group of electrodes for a second chip thereon;
- and
- placing the interconnection layer carrying structure onto the base substrate by leveraging the extended part of the support substrate, the interconnection layer of the interconnection layer carrying structure being placed in a defined area on the base substrate between the first group and the second group of the electrodes.
A method for fabricating an interconnection layer carrying structure used for transferring an interconnection layer onto a substrate, the method comprising:
- applying a release layer onto a support substrate;
- building a set of pads on the release layer;
- depositing a first organic insulating material over the set of pads and the release layer;
- developing the first organic insulating material such that the first organic insulating material is confined within a predefined area and has a set of second openings at the positions of the set of the pads;
- and
- building a plurality of traces on the first organic insulating material.
Dependencies are inferred from the claim text.