# US 11,114,307 B2 · Method of producing a wafer from an ingot including a peel-off detecting step > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,114,307 B2 - Document ID: US11114307B2 - Status: Granted - Kind: B2 - Application number: 16/365,014 - Filed: 2019-03-26 - Published: 2019-10-03 - Granted: 2021-09-07 - Earliest claimed: 2018-03-27 - Assignees: Disco Corporation - Applicants: Disco Corporation - Inventors: Ryohei Yamamoto - Web page: https://patentgrep.com/patent/US11114307B2 ## CPC - B23K 26/032: {using optical means} - H10P 36/03: {within silicon bodies} - B23K 26/0006: {taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence)} - B23K 26/0624: {using ultrashort pulses, i.e. pulses of 1 ns or less} - B23K 26/0853: {Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane} - B23K 26/38: by boring or cutting - B23K 26/53: for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks - B28D 5/0011: {with preliminary treatment, e.g. weakening by scoring} - B28D 5/047: {by ultrasonic cutting (using abrading substances or abrading tools subjected to a bouncing action by ultrasonic energy B24B1/04)} - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - H10P 95/402: {of silicon bodies} - B23K 2103/52: {Ceramics} - B23K 2103/54: {Glass} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B28D: WORKING STONE OR STONE-LIKE MATERIALS ## Abstract A method of producing a wafer includes a peel-off layer forming step to form a peel-off layer in a hexagonal single-crystal ingot by applying a laser beam having a wavelength transmittable through the hexagonal single-crystal ingot while positioning a focal point of the laser beam in the hexagonal single-crystal ingot at a depth corresponding to the thickness of a wafer to be produced from an end face of the hexagonal single-crystal ingot, an ultrasonic wave generating step to generate ultrasonic waves from an ultrasonic wave generating unit positioned in facing relation to the wafer to be produced across a water layer interposed therebetween, thereby to break the peel-off layer, and a peel-off detecting step to detect when the wafer to be produced is peeled off the hexagonal single-crystal ingot by positioning an image capturing unit sideways of the wafer to be produced. ## Claims ### Claim 1 A method of producing a wafer from a hexagonal single-crystal ingot, comprising the steps of: forming a peel-off layer in the hexagonal single-crystal ingot by applying a laser beam having a wavelength transmittable through the hexagonal single-crystal ingot while positioning a focal point of the laser beam in the hexagonal single-crystal ingot at a depth corresponding to a thickness of a wafer to be produced from an end face of the hexagonal single-crystal ingot; generating ultrasonic waves from an ultrasonic wave generating unit positioned in facing relation to the wafer to be produced across a water layer interposed therebetween, thereby to break the peel-off layer; and positioning an image capturing unit sideways of the wafer to be produced and detecting when the wafer to be produced is peeled off the hexagonal single-crystal ingot wherein the image capturing unit is configured and arranged to capture an image of a gap between the wafer to be produced and an upper surface of a remaining portion of the hexagonal single-crystal ingot. ### Claim 2 (depends on 1) The method according to claim 1, wherein: the hexagonal single-crystal ingot includes a hexagonal single-crystal SiC ingot having a c-axis and a c-plane perpendicular to the c-axis; and the peel-off layer forming step of forming a peel-off layer includes the peel-off layer that is made up of modified regions where SiC is separated into Si and C in the ingot and a succession of cracks extending isotropically along the c-plane from the modified regions, by applying a laser beam having a wavelength transmittable through hexagonal single-crystal SiC to the hexagonal single-crystal SiC ingot while a focal point of the laser beam is being positioned in the hexagonal single-crystal SiC ingot at a depth corresponding to a thickness of the wafer from an end face of the hexagonal single-crystal SiC ingot. ### Claim 3 (depends on 2) The method according to claim 2, wherein: the hexagonal single-crystal ingot includes a hexagonal single-crystal SiC ingot having a c-axis inclined to a line normal to an end face thereof and a c-plane, the c-plane and the end face forming an off-angle therebetween; and the peel-off layer forming step of forming a peel-off layer includes the peel-off layer that is formed by continuously forming a modified region in the hexagonal single-crystal SiC ingot in a direction perpendicular to a direction in which the off-angle is formed, producing the succession of cracks extending isotropically along the c-plane from the modified region, indexing-feeding the hexagonal single-crystal SiC ingot and the focal point relatively to each other by a distance that is not larger than a width of the cracks in the direction in which the off-angle is formed, then continuously forming a modified region in the hexagonal single-crystal SiC ingot in the direction perpendicular to the direction in which the off-angle is formed, and producing the succession of cracks extending isotropically along the c-plane from the last-mentioned modified region. ### Claim 4 (depends on 1) The method according to claim 1, wherein the gap between the wafer to be produced and the upper surface of the remaining portion of the hexagonal single crystal ingot is detected by a peel-off detecting means that binarizes the image captured by the image capturing unit. ### Claim 5 (depends on 4) The method according to claim 4, wherein the peel-off detecting means determines whether the gap is greater than or equal to a predetermined value. ### Claim 6 (depends on 5) The method according to claim 5, wherein when it has been determined that the gap is greater than the predetermined value, the generating of the ultrasonic waves from the ultrasonic wave generating unit is stopped. ### Claim 7 (depends on 4) The method according to claim 4, wherein the peel-off detecting means determines whether the gap is less than or equal to a predetermined value. ### Claim 8 (depends on 7) The method according to claim 7, wherein when it has been determined that the gap is less than the predetermined value, the generating of the ultrasonic waves from the ultrasonic wave generating unit is continued. ### Claim 9 (depends on 1) The method according to claim 1, wherein a peel-off detecting means determines whether the gap is greater than or equal to a predetermined value. ### Claim 10 (depends on 9) The method according to claim 9, wherein when it has been determined that the gap is greater than the predetermined value, the generating of the ultrasonic waves from the ultrasonic wave generating unit is stopped. ### Claim 11 (depends on 1) The method according to claim 1, wherein a peel-off detecting means determines whether the gap is less than or equal to a predetermined value. ### Claim 12 (depends on 11) The method according to claim 11, wherein when it has been determined that the gap is less than the predetermined value, the generating of the ultrasonic waves from the ultrasonic wave generating unit is continued. ### Claim 13 (depends on 1) The method according to claim 1, wherein while the ultrasonic wave generating unit is generating the ultrasonic waves, the hexagonal single-crystal ingot is rotated, thereby allowing for the gap to be detected along an entire circumference of the hexagonal single-crystal ingot.