Thermal management in high power RF MEMS switches

A MEMS device, comprising:

• a substrate having a plurality of electrodes formed therein, wherein the plurality of electrodes comprises at least an anchor electrode, a pull-in electrode and an RF electrode;
• a first insulating layer disposed over the plurality of electrodes and the substrate;
• a switching element disposed over the first insulating layer, wherein the switching element includes an anchor portion, a leg portion and a bridge portion and wherein the anchor portion is electrically coupled to the anchor electrode, and wherein the switching element comprises an electrically conductive material;
• a first post coupled to the RF electrode, and the first post is disposed directly on both the RF electrode and the first insulating layer;
• a second post disposed over the anchor electrode and electrically coupled to the anchor electrode through a first opening formed in the first insulating layer, wherein the switching element is movable between a first position spaced from the first post and the second post, and a second position in contact with the first post and the second post;
• and
• a second insulating layer disposed on a bottom surface of the switching element, wherein the first post contacts the electrically conductive material of the switching element through the second insulating layer when the switching element is in the second position.

A method of forming a MEMS device, comprising:

• depositing an insulating layer over a substrate, the substrate having a plurality of electrodes formed therein, wherein the plurality of electrodes includes at least an anchor electrode, a pull-in electrode and an RF electrode, wherein the insulating layer is disposed over the plurality of electrodes and the substrate;
• removing at least a portion of the insulating layer to expose at least a portion of the anchor electrode and at least a portion of the RF electrode;
• forming a first post over and in contact with the RF electrode, wherein the first post comprises an electrically conductive material, and the first post is disposed directly on both the RF electrode and the insulating layer;
• forming a second post over and in contact with the anchor electrode through an opening formed in the insulating layer;
• and
• forming a switching element over the substrate, first post and second post, wherein the switching element is disposed over the insulating layer, wherein the switching element includes an anchor portion that is electrically coupled to the anchor electrode, a bridge portion, and a leg portion and the RF electrode, wherein the switching element is movable between a first position spaced from the first post and the second post and a second position in contact with the first post and the second post.

A method of forming a MEMS device, comprising:

• depositing an insulating layer over a substrate, the substrate having a plurality of electrodes formed therein, wherein the plurality of electrodes includes at least an anchor electrode, a pull-in electrode and an RF electrode;
• removing at least a portion of the insulating layer to expose at least a portion of the anchor electrode and at least a portion of the RF electrode;
• forming a first post over and in contact with the RF electrode, wherein the first post comprises an electrically conductive material and the first post is disposed directly on both the RF electrode and the insulating layer;
• forming a second post over the anchor electrode, wherein the second post is electrically coupled to the anchor electrode through an opening formed in the insulating layer;
• and
• forming a switching element over the substrate, first post and second post, wherein the switching element includes an anchor portion that is electrically coupled to the anchor electrode, a leg portion and the RF electrode, wherein the switching element is movable from a first position spaced from the first post and the second post and a second position in contact with the first post and the second post, wherein the switching element has a bottom surface that has an insulating portion and a conductive portion, and wherein the insulating portion contacts the second post in the second position and the conductive portion contacts the first post in the second position.