Electronic device, device package, and method of fabrication

A device comprising:

• a leadframe, the leadframe including:
• a first leadframe element having a first surface;
• a second leadframe element adjacent to the first leadframe element, the first and second leadframe elements being separate from one another, the second leadframe element having a second surface;
• a first flange extending from a first outer edge of the first leadframe element and extending away from the first surface of the first leadframe element, wherein the first flange has a first portion coupled to the first outer edge of the first leadframe element and a second portion having a third surface, the third surface being nonparallel to the first surface of the first leadframe element;
• and
• a second flange extending from a second outer edge of the second leadframe element and extending away from the second surface of the second leadframe element, wherein the second flange has a third portion coupled to the second outer edge of the second leadframe element and a fourth portion having a fourth surface, the fourth surface being nonparallel to the second surface of the second leadframe element;
• and
• an electronic component coupled to the first and second surfaces of the first and second leadframe elements such that the first and second flanges are located at opposing first and second sidewalls of the electronic component.

A device comprising:

• a leadframe, the leadframe including:
• a first leadframe element having a first surface;
• a second leadframe element adjacent to the first leadframe element, the first and second leadframe elements being separate from one another, the second leadframe element having a second surface;
• a first flange extending from a first outer edge of the first leadframe element and extending away from the first surface of the first leadframe element and
• a second flange extending from a second outer edge of the second leadframe element and extending away from the second surface of the second leadframe element, wherein:
• a first recessed region of the first leadframe element is formed in a first plane;
• a second recessed region of the second leadframe element is formed in the first plane;
• and
• a remainder of the leadframe is formed in a second plane parallel to and displaced away from the first plane, wherein the first flange extends from the first outer edge of the first recessed region of the first leadframe element toward the second plane of the remainder of the leadframe and the second flange extends from the second outer edge of the second recessed region of the second leadframe element toward the second plane of the remainder of the leadframe;
• and
• an electronic component coupled to the first and second surfaces of the first and second leadframe elements such that the first and second flanges are located at opposing first and second sidewalls of the electronic component.

A method comprising:

• providing a leadframe having a first leadframe element and a second leadframe adjacent to the first leadframe element, the first and second leadframe elements being separate from one another, the first leadframe element having a first surface and the second leadframe element having a second surface, wherein the providing the leadframe comprises providing a die pad positioned proximate first and second ends of the first and second leadframe elements;
• providing a first flange extending from a first outer edge of the first leadframe element and extending away from the first surface of the first leadframe element;
• providing a second flange extending from a second outer edge of the second leadframe element and extending away from the second surface of the second leadframe element;
• coupling an electronic component to the first and second surfaces of the first and second leadframe elements such that the first and second flanges are located at opposing first and second sidewalls of the electronic component;
• coupling a die to the die pad;
• bonding one or more wires between the die and the first and second ends of the first and second leadframe elements;
• and
• forming a molding compound on the leadframe, the electronic component, the die, the one or more wires, and the first and second leadframe elements to produce a packaged device.

A device comprising:

• a leadframe, the leadframe including:
• a first leadframe element having a first surface;
• a second leadframe element adjacent to the first leadframe element, the first and second leadframe elements being separate from one another, the second leadframe element having a second surface;
• a first flange extending from a first outer edge of the first leadframe element and extending away from the first surface of the first leadframe element, the first flange having a first portion coupled to the first outer edge of the first leadframe element and a second portion having a third surface, the third surface being nonparallel to the first surface of the first leadframe element;
• and
• a second flange extending from a second outer edge of the second leadframe element and extending away from the second surface of the second leadframe element, the second flange having a third portion coupled to the second outer edge of the second leadframe element and a fourth portion having a fourth surface, the fourth surface being nonparallel to the second surface of the second leadframe element;
• and
• an electronic component coupled to the first and second surfaces of the first and second leadframe elements such that the first and second portions of the first and second flanges are located at opposing first and second sidewalls of the electronic component, wherein the electronic component is coupled to the first and second surfaces of the first and second leadframe elements by an adhesive layer.