Resistive element and method of manufacturing the same

A method of manufacturing a resistive element, comprising:

• depositing a field insulating film on a semiconductor substrate;
• depositing a plurality of resistive layers on the field insulating film;
• depositing an interlayer insulating film to cover the field insulating film and the plurality of resistive layers;
• forming, in the interlayer insulating film, a first contact hole on which one edge of one resistive layer selected from the plurality of resistive layers is exposed, a second contact hole on which another edge of the selected resistive layer is exposed at position separated from the first contact hole, and a third contact hole on which a top surface of the semiconductor substrate is partly exposed at position separated from the first and second contact holes;
• forming a pad-forming electrode electrically connected to the one edge of the selected resistive layer via the first contact hole, and a relay wire electrically connected to another edge of the selected resistive layer via the second contact hole to form an ohmic contact to the semiconductor substrate via the third contact hole;
• and
• forming a rear surface electrode under the semiconductor substrate,
• wherein the resistive element uses, as a resistor, an electric channel between the at least one pad-forming electrode and the rear surface electrode.