# US 11,114,218 B2 · Mechanical stress isolation conductors in lead frames > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,114,218 B2 - Document ID: US11114218B2 - Status: Granted - Kind: B2 - Application number: 16/710,503 - Filed: 2019-12-11 - Published: 2021-06-17 - Granted: 2021-09-07 - Earliest claimed: 2019-12-11 - Assignees: Vitesco Technologies USA, LLC - Applicants: Vitesco Technologies USA, LLC - Inventors: Andrew Wisniewski; Laura Church - Web page: https://patentgrep.com/patent/US11114218B2 ## CPC - H01B 7/29: Protection against damage caused by extremes of temperature or by flame {(heat dissipation or conduction H01B7/42)} - B29C 45/14639: {for obtaining an insulating effect, e.g. for electrical components} - B29C 45/1671: {with an insert} - H02B 1/20: Bus-bar or other wiring layouts, e.g. in cubicles, in switchyards (installations of bus-bars H02G5/00) - B29C 45/14336: {Coating a portion of the article, e.g. the edge of the article (B29C45/14573 and B29C45/14598 take precedence)} - B29K 2101/12: Thermoplastic materials - B29L 2031/36: Plugs, connectors, or parts thereof - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - H02B: BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER - B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES ## Abstract An electrical device includes an electrically conductive member, an overmold material disposed about a portion of the electrically conductive member and a membrane disposed between the overmold material and at least a portion of the electrically conductive member. The membrane has a compressibility greater that a compressibility of the overmold material such that at least a portion of relative thermal expansion between the electrically conductive member relative to the overmold material is absorbed by the membrane. ## Claims ### Claim 1 An electrical device comprising: an electrically conductive member; an overmold material disposed about a portion of the electrically conductive member; and a membrane disposed between the overmold material and at least a portion of the electrically conductive member, wherein the membrane has a compressibility greater that a compressibility of the overmold material such that at least a portion of relative thermal expansion between the electrically conductive member relative to the overmold material is absorbed by the membrane; wherein the electrically conductive member comprises a bus bar with a first end and a second end that extend outward from the overmold material and the membrane is disposed over the bus bar and the membrane encapsulated on all sides with the overmold material. ### Claim 2 (depends on 1) The electrical device as recited in claim 1, wherein the membrane comprises an elastic material and the overmold material comprises a thermoplastic material. ### Claim 3 (depends on 1) The electrical device as recited in claim 1, wherein the membrane is disposed about top, bottom and side surfaces of the electrically conductive member. ### Claim 4 (depends on 1) The electrical device as recited in claim 1, wherein the membrane is disposed at several separate areas of the bus bar and is encapsulated entirely within the over mold material. ### Claim 5 (depends on 1) The electrical device as recited in claim 1, wherein the membrane comprises a melting temperature that is greater than a melting point of the overmold material. ### Claim 6 (depends on 1) The electrical device as recited in claim 1, wherein the electrical device comprises a mainframe and the electrically conductive member comprises a bus bar on one end and a connection to at least one electric conduit on a second end. ### Claim 7 (depends on 1) The electrical device as recited in claim 1, wherein the membrane includes a membrane thickness, wherein the membrane thickness is greater than a difference between thermal expansion of the electrically conductive member and the overmold material at a predefined operating temperature. ### Claim 8 (depends on 7) The electrical device as recited in claim 7, wherein the membrane thickness is uniform about the electrically conductive member. ### Claim 9 (depends on 7) The electrical device as recited in claim 7, wherein the membrane thickness is less than a thickness of the overmold material. ### Claim 10 A mainframe assembly comprising: a connector portion including a plurality of conductors; a bus bar in electrical communication with some of the plurality of conductors; a mainframe portion formed from an overmold material encapsulating portions of the plurality of conductors and the bus bar; and a membrane disposed between the overmold material of the main frame portion and at least a portion of the bus bar, wherein the membrane has a compressibility greater that a compressibility of the overmold material such that at least a portion of relative thermal expansion between the electrically conductive member relative to the overmold material is absorbed by the membrane; wherein the membrane comprises an elastic material and the overmold material comprises a thermoplastic material, and the membrane is disposed at several separate areas of the bus bar and the membrane is encapsulated entirely within the over mold material. ### Claim 11 (depends on 10) The mainframe assembly as recited in claim 10, wherein the membrane is disposed on the portions of the bus bar covered by the overmold material. ### Claim 12 (depends on 10) The mainframe assembly as recited in claim 10, wherein the membrane includes a membrane thickness, wherein the membrane thickness is greater than a difference between thermal expansion of the electrically conductive member and the overmold material at a predefined operating temperature. ### Claim 13 A method of assembling an electrical device comprising: pre-molding a portion of an electrical conduit with an elastic membrane; and molding the electrical conduit with an thermoplastic overmold material that covers all portions of the electrical conduit covered by the elastic membrane such that the elastic membrane is encapsulated entirely by the overmold material, wherein the elastic membrane has a compressibility greater that a compressibility of the thermoplastic overmold material such that at least a portion of relative thermal expansion between the electrically conductive member relative to the overmold material is absorbed by the elastic membrane. ### Claim 14 (depends on 13) The method as recited in claim 13, including pre-molding the elastic membrane to a membrane thickness that is greater than a difference between thermal expansion of the electrically conductive member and the thermoplastic overmold material at a predefined operating temperature. ### Claim 15 (depends on 14) The method as recited in claim 14, wherein the membrane thickness is less than a thickness of the overmold material. ### Claim 16 (depends on 13) The method as recited in claim 13, including pre-molding separate and spaced apart portions of the electrically conductive member with the elastic membrane. ### Claim 17 (depends on 13) The method as recited in claim 13, wherein the membrane thickness is uniform about the electrically conductive member.