# US 11,114,120 B2 · Plural heat-sink layers for an On-Wafer Laser of a heat-assisted magnetic recording device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,114,120 B2 - Document ID: US11114120B2 - Status: Granted - Kind: B2 - Application number: 17/111,201 - Filed: 2020-12-03 - Published: 2021-03-25 - Granted: 2021-09-07 - Earliest claimed: 2017-08-02 - Assignees: Seagate Technology LLC - Applicants: Seagate Technology LLC - Inventors: Helene Parwana Habibi; Daniela Diamare; Thomas Liam White; Gavin Lee Brinkley - Web page: https://patentgrep.com/patent/US11114120B2 ## CPC - G11B 5/4866: {the arm comprising an optical waveguide, e.g. for thermally-assisted recording} - H01S 5/0225: Out-coupling of light - H01S 5/02469: {Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC} - G11B 5/6088: {Optical waveguide in or on flying head} - G11B 2005/0021: {Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal} - G11B: INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER (recording measured values in a way that does not require playback through a transducer G01D9/00; recording or playback apparatus using mechanically marked tape, e.g. punched paper tape, or using unit records, e.g. punched or magnetically marked cards G06K; transferring data from one type of record carrier to another G06K1/18; circuits for coupling output of reproducer to radio receiver H04B1/20; gramophone pick-ups or like acoustic electromechanical transducers or circuits therefor H04R) - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL ## Abstract An apparatus includes a substrate and a reader deposited on the substrate. A laser is formed on a non-self supporting structure and bonded to the substrate. A plurality of heat sink layers are deposited between the reader and the laser and configured to provide thermal coupling between the substrate and the laser and sink heat away from the laser. A waveguide is deposited proximate the laser. The waveguide is configured to communicate light from the laser to a near-field transducer that directs energy resulting from plasmonic excitation to a recording medium. ## Claims ### Claim 1 An apparatus, comprising: a substrate; a reader deposited on the substrate; a laser formed on a non-self supporting structure and bonded to the substrate; a plurality of heat sink layers deposited between the reader and the laser and configured to provide thermal coupling between the substrate and the laser and sink heat away from the laser, wherein at least one of the plurality of heat sink layers has a different width than at least one other of the plurality of heat sink layers; and a waveguide deposited proximate the laser, the waveguide configured to communicate light from the laser to a near-field transducer that directs energy resulting from plasmonic excitation to a recording medium. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the at least one heat sink layer having a different width is a heat sink layer directly adjacent the laser. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein the at least one heat sink layer having a different width is a heat sink layer other than the heat sink layer directly adjacent the laser. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein each of the heat sink layers of the plurality of heat sink layers has a different width than any of the other of the plurality of heat sink layers. ### Claim 5 (depends on 4) The apparatus of claim 4, wherein the width of each of the heat sink layers increases as the distance between each heat sink layer and the laser increases. ### Claim 6 (depends on 1) The apparatus of claim 1, wherein a heat sink layer directly adjacent the laser has substantially a same coefficient of thermal expansion as that of the laser. ### Claim 7 (depends on 1) The apparatus of claim 1, wherein at least one of the plurality of heat sink layers comprises a different material than at least one other of the plurality of heat sink layers. ### Claim 8 (depends on 1) The apparatus of claim 1, wherein at least one of the plurality of heat sink layers has a different thickness than at least one other of the plurality of heat sink layers. ### Claim 9 (depends on 1) The apparatus of claim 1, wherein each of the heat sink layers of the plurality of heat sink layers has a different thickness than any of the other of the plurality of heat sink layers. ### Claim 10 (depends on 1) The apparatus of claim 1, further comprising a reader amplifier, wherein the plurality of heat sink layers is configured to provide thermal coupling between the substrate and the reader amplifier and sink heat away from the reader amplifier. ### Claim 11 An apparatus, comprising: a waveguide core deposited on a substrate within a slider, the waveguide core configured to communicate light from a laser to a near-field transducer that directs energy resulting from plasmonic excitation to a recording medium; a structure transfer-printed and bonded to the substrate within the slider such that a major surface of the structure is substantially parallel to, and the structure is offset in a down-track direction from, a major surface of the waveguide core; and a plurality of heat sink layers deposited between the substrate and the structure and configured to provide thermal coupling between the slider and the structure and to sink heat away from the structure, wherein at least one of the plurality of heat sink layers has a different width than at least one other of the plurality of heat sink layers. ### Claim 12 (depends on 11) The apparatus of claim 11, wherein the structure is a reader amplifier. ### Claim 13 (depends on 11) The apparatus of claim 11, wherein the structure is a laser. ### Claim 14 (depends on 11) The apparatus of claim 11, wherein each of the heat sink layers of the plurality of heat sink layers has a different width than any of the other of the plurality of heat sink layers. ### Claim 15 (depends on 14) The apparatus of claim 14, wherein the width of each of the heat sink layers increases as the distance between each heat sink layer and the structure increases. ### Claim 16 (depends on 11) The apparatus of claim 11, wherein the at least one heat sink layer having a different width is a heat sink layer directly adjacent the structure. ### Claim 17 (depends on 11) The apparatus of claim 11, wherein the at least one heat sink layer having a different width is a heat sink layer other than the heat sink layer directly adjacent the structure. ### Claim 18 (depends on 11) The apparatus of claim 11, wherein at least one of the plurality of heat sink layers has a different thickness than at least one other of the plurality of heat sink layers. ### Claim 19 A method, comprising: depositing a read transducer on a substrate; depositing a plurality of heat sink layers over the read transducer, wherein at least one of the plurality of heat sink layers has a different width than at least one other of the plurality of heat sink layers; transfer printing a laser diode unit over the plurality of heat sink layers; and depositing a waveguide core over the laser diode unit, wherein the plurality of heat sink layers are configured to provide thermal coupling between the laser diode unit and the substrate and to sink heat away from the laser diode unit. ### Claim 20 (depends on 19) The method of claim 19, wherein each of the heat sink layers of the plurality of heat sink layers has a different width than any of the other of the plurality of heat sink layers.