# US 11,112,841 B2 · 5G mmWave cooling through PCB

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- Number: US 11,112,841 B2
- Document ID: US11112841B2
- Status: Granted
- Kind: B2
- Application number: 16/481,396
- Filed: 2017-04-01
- Published: 2019-12-12
- Granted: 2021-09-07
- Earliest claimed: 2017-04-01
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Divya Mani; William J. Lambert; Shawna Liff; Sergio A. Chan Arguedas; Robert L. Sankman
- Web page: https://patentgrep.com/patent/US11112841B2

## CPC

- G06F 1/203: {for portable computers, e.g. for laptops}
- H01Q 23/00: Antennas with active circuits or circuit elements integrated within them or attached to them
- H04B 1/40: Circuits
- H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)}
- H05K 3/3494: Heating processes for reflow soldering
- H10W 40/228: {the projecting parts being wire-shaped or pin-shaped}
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/68: Shapes or dispositions thereof
- H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)}
- H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)}
- H05K 2201/10734: Ball grid array [BGA]; Bump grid array
- H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W 44/248: {for antennas}
- H10W 44/251: {for monolithic microwave integrated circuits [MMIC]}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 90/00: Package configurations
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- Y10T 29/49128: Assembling formed circuit to base
- Y10T 29/49144: by metal fusion
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H04B: TRANSMISSION
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Embodiments of the invention include a mmWave transceiver and methods of forming such devices. In an embodiment, the mmWave transceiver includes an RF module. The RF module may include a package substrate, a plurality of antennas formed on the package substrate, and a die attached to a surface of the package substrate. In an embodiment, the mmWave transceiver may also include a mainboard mounted to the RF module with one or more solder balls. In an embodiment, a thermal feature is embedded within the mainboard, and the thermal feature is separated from the die by a thermal interface material (TIM) layer. According to an embodiment, the thermal features are slugs and/or vias. In an embodiment, the die compresses the TIM layer resulting in a TIM layer with minimal thickness.

## Claims

### Claim 1

A mmWave transceiver, comprising:
an RF module, wherein the RF module comprises:
a package substrate;
a plurality of antennas formed on the package substrate;
a first die attached to a surface of the package substrate; and
a second die attached to the surface of the package substrate; and
a mainboard mounted to the RF module with a plurality of solder balls, wherein a thermal feature is embedded within the mainboard, wherein the thermal feature is separated from the first die and the second die by a thermal interface material (TIM) layer, and wherein the first die and the second die are within a region inside of a footprint of the plurality of solder balls.

### Claim 2 (depends on 1)

The mmWave transceiver of claim 1, wherein the thermal feature is a slug that passes completely through the mainboard.

### Claim 3 (depends on 1)

The mmWave transceiver of claim 1, wherein the thermal feature is a plurality of vias that pass completely through the mainboard.

### Claim 4 (depends on 1)

The mmWave transceiver of claim 1, further comprising:
a heat spreader attached to the mainboard, wherein the heat spreader is coupled to the thermal feature.

### Claim 5 (depends on 4)

The mmWave transceiver of claim 4, wherein the heat spreader is coupled to the thermal feature by a second TIM layer.

### Claim 6 (depends on 4)

The mmWave transceiver of claim 4, wherein the heat spreader is directly attached to the thermal feature.

### Claim 7 (depends on 1)

The mmWave transceiver of claim 1, wherein the TIM layer is less than approximately 50 μm thick.

### Claim 8 (depends on 7)

The mmWave transceiver of claim 7, wherein the TIM layer is less than approximately 40 μm thick.

### Claim 9 (depends on 1)

The mmWave transceiver of claim 1, wherein the TIM layer has a thickness that is approximately equal to the average size of filler particles in the TIM layer.

### Claim 10 (depends on 1)

The mmWave transceiver of claim 1, wherein the solder balls are ball grid array (BGA) balls.

### Claim 11 (depends on 10)

The mmWave transceiver of claim 10, wherein a height of the plurality of solder balls is between approximately 500 μm and 750 μm.

### Claim 12 (depends on 11)

The mmWave transceiver of claim 11, wherein the height of the plurality of solder balls is between approximately 630 μm and 700 μm.

### Claim 13

A mmWave transceiver, comprising:
an RF module, wherein the RF module comprises:
a package substrate;
a plurality of antennas formed on the package substrate;
a plurality of dies attached to a surface of the package substrate;
a mainboard mounted to the RF module with a plurality of solder balls, wherein a plurality of thermal features are embedded within the mainboard, wherein the thermal features are slugs and/or vias, wherein the thermal features are separated from the plurality of dies by a thermal interface material (TIM) layer, and wherein the plurality of dies is within a region inside of a footprint of the plurality of solder balls; and
a heat spreader attached to the mainboard, wherein the heat spreader is coupled to the thermal feature.

### Claim 14 (depends on 13)

The mmWave transceiver of claim 13, wherein the TIM layer is less than approximately 40 μm thick.