# US 11,112,699 B2 · Substrate having film type pattern and the manufacturing method for making the same

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- Number: US 11,112,699 B2
- Document ID: US11112699B2
- Status: Granted
- Kind: B2
- Application number: 15/461,899
- Filed: 2017-03-17
- Published: 2017-09-21
- Granted: 2021-09-07
- Earliest claimed: 2016-03-17
- Applicants: Ming-An Hsu
- Inventors: Ming-An Hsu
- Web page: https://patentgrep.com/patent/US11112699B2

## CPC

- G03F 7/40: Treatment after imagewise removal, e.g. baking
- G03F 7/2014: {Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame}
- H04B 1/3888: Arrangements for carrying or protecting transceivers
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- H04B: TRANSMISSION

## Abstract

A substrate having film type pattern and the manufacturing method, the substrate having film type pattern includes: a substrate; at least film type pattern layer which is allocated on the substrate; and a peripheral pattern layer which is allocated around the film type pattern layer.

## Claims

### Claim 1

A substrate having a film pattern, comprising:
a 3-dimensional substrate including a first section having a first height, a second section having a second height that is different from the first height, and a dimensional part connecting the first section and the second section;
a photoresist pattern layer including a first pattern section formed on the first section of the 3-dimensional substrate and a second pattern section formed on the second section of the 3-dimensional substrate; and
at least a film pattern layer formed only on the dimensional part of the 3-dimensional substrate, the film pattern layer contacting the first pattern section and the second pattern section of the photoresist pattern layer, wherein
a top surface of the first pattern section and a top surface of the second pattern section of the photoresist pattern layer are free from the film pattern layer, and
the film pattern layer is a structure independent from the first pattern section and the second pattern section and attached to a side surface of the first pattern section and a side surface of the second pattern section.

### Claim 2 (depends on 1)

The substrate of claim 1, wherein the film pattern layer is selected from the group consisting of: a metal film layer, an inorganic metal oxide film layer, a non-metal oxide film layer and a non-metal film layer.

### Claim 3 (depends on 1)

The substrate of claim 1, wherein the photoresist pattern layer is an underlying photoresist layer or selected from the group consisting of: a metal film layer, an inorganic metal oxide film layer, a non-metal oxide film layer and a non-metal film layer.

### Claim 4 (depends on 1)

A manufacturing method for making the substrate according to claim 1, comprising:
forming an underlying color layer on a substrate;
forming a lift-off photoresist layer on the substrate having the underlying color layer;
providing a photomask attached on the substrate;
processing an exposure;
removing an unexposed part of the lift-off photoresist layer to form a pattern space;
removing the underlying color layer under the pattern space formed by the lift-off photoresist;
forming at least a film layer on a partial region having the pattern space of the substrate; and
forming a film type pattern by removing the lift off photoresist layer, wherein the film type layer is adjacent the underlying color layer to form a seamlessly close structure.

### Claim 5 (depends on 4)

The method of claim 4, wherein the at least a film layer is selected from the group consisting of: a metal film layer, an inorganic metal oxide film layer, a non-metal oxide film layer and a non-metal film layer.

### Claim 6 (depends on 4)

The method of claim 4, wherein the substrate comprises a plate substrate or a 3-dimensional substrate.

### Claim 7 (depends on 4)

The method of claim 4, wherein the underlying color layer comprises a metal film layer, an inorganic metal oxide film layer, a non-metal oxide film layer or a non-metal film layer.

### Claim 8 (depends on 4)

The method of claim 4, wherein the method for forming the film layer includes sputtering, deposition or spraying.

### Claim 9 (depends on 1)

A manufacturing method for making the substrate according to claim 1, comprising steps of:
forming an underlying photoresist layer on a substrate;
forming a lift-off photoresist layer on the substrate having the underlying photoresist layer;
providing a photomask attached on the substrate;
processing an exposure;
once removing an unexposed part of the lift-off photoresist layer and the underlying photoresist layer to form a pattern space;
forming at least a film layer on partial region having the pattern space of the substrate; and
forming a film type pattern by removing the lift off photoresist layer, wherein the film type layer is adjacent the underlying color layer to form a seamlessly close structure.

### Claim 10 (depends on 9)

The method of claim 9, wherein the at least a film layer is selected from the group consisting of: a metal film layer, an inorganic metal oxide film layer, a non-metal oxide film layer and a non-metal film layer.

### Claim 11 (depends on 9)

The method of claim 9, wherein the substrate comprises a plate substrate or a 3-dimensional substrate.

### Claim 12 (depends on 9)

The method of claim 9, wherein the substrate is a 3-dimensional substrate, and the film type pattern is formed on the dimensional part of the 3-dimensional substrate.