Array substrate and manufacturing method thereof, and electronic device
AssigneesChongqing Boe Optoelectronics Technology Co., Ltd., Boe Technology Group Co., Ltd.
InventorsXiaoji Li, Yanli Zhao, Zhe Li, Peng Li, Haoxiang Fan
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Abstract
An array substrate, a manufacturing method thereof, and an electronic device are provided. The array substrate includes: a base substrate having a first side, a second side opposite to the first side and a via hole passing through a plate body of the base substrate; a switch element at the first side of the base substrate; and a pixel electrode which is at the second side of the base substrate and which is electrically connected with the switch element through the via hole.
Claims20
An array substrate, comprising:
- a base substrate having a via hole passing through the base substrate in a thickness direction of the base substrate;
- a switch element at a first side of the base substrate;
- and
- a pixel electrode at a second side of the base substrate, wherein the first side and the second side are opposite to each other in the thickness direction of the base substrate, and the pixel electrode is electrically connected with the switch element through the via hole.
A manufacturing method of an array substrate, comprising:
- performing a hole-producing process on a base substrate so that the base substrate is formed with a via hole passing through a plate body of the base substrate;
- forming a switch element at a first side of the base substrate;
- and
- forming a pixel electrode at a second side, opposite to the first side, of the base substrate, wherein the pixel electrode is electrically connected with the switch element through the via hole.
An array substrate, comprising:
- a base substrate having a first side, a second side opposite to the first side, and a via hole passing through a plate body of the base substrate;
- a signal line at the first side of the base substrate;
- a switch element which is at the second side of the base substrate and which is electrically connected with the signal line through the via hole;
- and
- a pixel electrode which is at the second side of the base substrate and which is electrically connected with the switch element.
Dependencies are inferred from the claim text.