# US 11,112,658 B2 · Method of installing electronic component, display device and display system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,112,658 B2 - Document ID: US11112658B2 - Status: Granted - Kind: B2 - Application number: 16/563,465 - Filed: 2019-09-06 - Published: 2019-12-26 - Granted: 2021-09-07 - Earliest claimed: 2016-09-28 - Assignees: LG Display Co., Ltd. - Applicants: LG Display Co., Ltd. - Inventors: Kaoru Furuta - Web page: https://patentgrep.com/patent/US11112658B2 ## CPC - G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels} - G02F 1/13336: {Combining plural substrates to produce large-area displays, e.g. tiled displays} - H05K 1/189: characterised by the use of flexible or folded printed circuits - H05K 3/346: Solder materials or compositions specially adapted therefor - H10W 70/655: Fan-out layouts - H10W 72/012: {of bump connectors, dummy bumps or thermal bumps} - H10W 72/072: {of bump connectors} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A display device, a display system, and a method of installing an electronic component are disclosed. In one embodiment, the electronic component is junctioned to a display panel of the display device using an auto-agglutination solder. The installation method includes positioning the electronic component having an electronic component side line connection part at a substrate stack that includes two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line; forming an auto-agglutination solder between the electronic component side line connection part and the substrate side line connection part; and pressurizing the electronic component side line connection part and the substrate side line connection part by heating-up the auto-agglutination solder. ## Claims ### Claim 1 A method of installing an electronic component, comprising: positioning the electronic component including an electronic component side line connection part at a vertical end surface of a substrate stack that includes two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line, the electronic component side line connection part facing the vertical end surface, the substrate side line connection part at the end of the line being substantially coplanar with the vertical end surface of the substrate stack and the substrate side line connection part at the end of the line not extending beyond the vertical end surface of the substrate stack; forming an auto-agglutination solder between the electronic component side line connection part and the substrate side line connection part, the auto-agglutination solder including a thermosetting resin and one or more solder particles; positioning the auto-agglutination solder to contact the substrate side line connection part at the end of the line; and pressurizing the electronic component side line connection part and the substrate side line connection part by heating-up the auto-agglutination solder to electrically connect the substrate side line connection part and the electronic component side line connection part to each other by the auto-agglutination solder, wherein the line includes at least one of Al and Cu, and the substrate side line connection part includes at least one of Sn, Pb and Zn. ### Claim 2 (depends on 1) The method according to claim 1, wherein the substrate side line connection part is connected to the end of the line and formed along the vertical end surface, and the substrate side line connection part is a connection pad formed of a conductive material. ### Claim 3 (depends on 1) The method according to claim 1, wherein the substrate side line connection part is a portion of the end of the line that is exposed in a space between the two substrates. ### Claim 4 (depends on 1) The method according to claim 1, wherein the electronic component side line connection part has a vertical length that is larger than the substrate side line connection part. ### Claim 5 (depends on 4) The method according to claim 4, wherein the vertical length of the electronic component side line connection part is larger than a reference length that is based on an amount of the solder particles required for soldering of the electronic component side line connection part and the substrate side line connection part, and a gap between the electronic component side line connection part and the substrate side line connection part. ### Claim 6 (depends on 1) The method according to claim 1, wherein the auto-agglutination solder is a paste that is coated on the substrate side line connection part. ### Claim 7 (depends on 6) The method according to claim 6, wherein the auto-agglutination solder is coated by one of a screen printing process, a mesh-mask printing process, and an ink-jet process. ### Claim 8 (depends on 1) The method according to claim 1, wherein the electronic component includes a film substrate including the electronic component side line connection part and a chip component on the film substrate. ### Claim 9 (depends on 1) The method according to claim 1, wherein the line having the substrate side line connection part is formed on at least one of the two substrates. ### Claim 10 (depends on 1) The method according to claim 1, wherein each of the two substrates is a glass substrate, a resin substrate, or a print substrate. ### Claim 11 (depends on 1) The method according to claim 1, wherein the substrate line connection part is formed at the vertical end surface of the substrate stack after attaching the two substrates. ### Claim 12 (depends on 1) The method according to claim 1, wherein the thermosetting resin has a melting point lower than the solder particles. ### Claim 13 A method of installing an electronic component, comprising: positioning the electronic component including an electronic component side line connection part at a vertical end surface of a substrate stack that includes two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line, the electronic component side line connection part facing the vertical end surface, the substrate side line connection part at the end of the line not extending beyond the vertical end surface of the substrate stack; forming an auto-agglutination solder between the electronic component side line connection part and the substrate side line connection part, the auto-agglutination solder including a thermosetting resin and one or more solder particles; positioning the auto-agglutination solder to contact the substrate side line connection part at the end of the line; and pressurizing the electronic component side line connection part and the substrate side line connection part by heating-up the auto-agglutination solder to electrically connect the substrate side line connection part and the electronic component side line connection part to each other by the auto-agglutination solder, wherein the line includes at least one of Al and Cu, and the substrate side line connection part includes at least one of Sn, Pb and Zn.