# US 11,112,452 B2 · IC tray and test jig

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- Number: US 11,112,452 B2
- Document ID: US11112452B2
- Status: Granted
- Kind: B2
- Application number: 16/557,172
- Filed: 2019-08-30
- Published: 2020-09-10
- Granted: 2021-09-07
- Earliest claimed: 2019-03-07
- Assignees: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation
- Applicants: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation
- Inventors: Akihiro Hayashida
- Web page: https://patentgrep.com/patent/US11112452B2

## CPC

- G01R 31/2867: {Handlers or transport devices, e.g. loaders, carriers, trays}
- G01R 31/2868: {Complete testing stations; systems; procedures; software aspects}
- G01R 31/2887: {involving moving the probe head or the IC under test; docking stations (moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392)}
- G01R 31/2893: {Handling, conveying or loading, e.g. belts, boats, vacuum fingers (G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H10P72/00)}
- G01R 31/2896: {Testing of IC packages; Test features related to IC packages (containers per se H10W76/10, encapsulations per se H10W74/00)}
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)

## Abstract

According to one embodiment, an IC tray mounting thereon IC packages to be tested includes a plurality of through-holes provided at a pitch equal to a pitch of terminals of the IC packages, and IC package mounting places on which the IC packages are to be mounted. The through-holes are provided in the IC package mounting places correspondingly to arrangement positions of the terminals of the IC packages. The IC package mounting places are provided correspondingly to a region of a test board where a plurality of test pins used for an electrical test to one of the IC packages are arranged.

## Claims

### Claim 1

A test jig comprising:
an IC tray mounting thereon IC packages to be tested;
a test board that includes support tables and electrode pads, the support tables being provided with test pins to be in contact with terminals of the IC packages mounted on the IC tray, the electrode pads being connected to the test pins through wiring lines; and
a tray transfer mechanism configured to grip the IC tray while pressing through a pad a first face of the IC tray on which the IC packages are to be mounted, and to transfer the IC tray to the test board, wherein
the IC tray includes
a plurality of through-holes provided at a pitch equal to a pitch of terminals of the IC packages, and
IC package mounting places on which the IC packages are to be mounted, and
the through-holes are provided in the IC package mounting places correspondingly to arrangement positions of the terminals of the IC packages, and
a plurality of test pins of the test board used for an electrical test to one of the IC packages are provided correspondingly to the IC package mounting places.

### Claim 2 (depends on 1)

The test jig according to claim 1, wherein
the IC packages are BGA IC packages in which the terminals are solder balls, and
the test pins of the test board and the through-holes of the IC tray are provided in accordance with arrangement positions of the solder balls.

### Claim 3 (depends on 1)

The test jig according to claim 1, wherein
the IC packages are QFP IC packages in which the terminals are lead frames, and
the test pins of the test board and the through-holes of the IC tray are provided in accordance with arrangement positions of the lead frames.

### Claim 4 (depends on 1)

The test jig according to claim 1, wherein the through-holes of the IC tray have a diameter that is constant from the first face to a second face opposite to the first face.

### Claim 5 (depends on 1)

The test jig according to claim 1, wherein the through-holes of the IC tray have a diameter that becomes smaller from the first face toward a second face opposite to the first face.

### Claim 6 (depends on 1)

The test jig according to claim 1, wherein the through-holes of the IC tray have a diameter that becomes larger from about a center of the IC tray in a thickness direction toward the first face of the IC tray and a second face opposite to the first face.