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US 11,112,424 B2Granted
Physical quantity sensor, complex sensor, inertial measurement unit, portable electronic device, electronic device, and vehicle
AssigneeSeiko Epson Corporation
InventorJuichiro Matsuzawa
Life of this patent
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Abstract
A physical quantity sensor includes a sensor element (acceleration sensor element) and a substrate (package) to which the sensor element is attached using a bonding material (resin adhesive), in which, when an elastic modulus of the bonding material is e, 2.0 GPa<e<7.8 GPa is satisfied.
Claims11
A physical quantity sensor comprising:
- a sensor element;
- and
- a ceramic substrate to which the sensor element is directly bonded using a bonding material,
- wherein, when an elastic modulus of the bonding material is e, 4.0 GPa≤e≤6.0 GPa is satisfied,
- wherein, in a plan view seen from a direction along an attachment direction of the sensor element and the substrate, and
- a ratio of a bonding area of the bonding material with respect to an area where the substrate and the sensor element overlap is higher than or equal to 80%.
3 more elements
Dependencies are inferred from the claim text.