# US 11,112,352 B2 · Saw based optical sensor device and package including the same

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- Number: US 11,112,352 B2
- Document ID: US11112352B2
- Status: Granted
- Kind: B2
- Application number: 16/183,545
- Filed: 2018-11-07
- Published: 2019-10-10
- Granted: 2021-09-07
- Earliest claimed: 2018-04-05
- Assignees: Haesung Ds Co., Ltd.
- Applicants: Haesung Ds Co., Ltd.
- Inventors: Jin Woo Lee; Byung Moon Lee; Jin Kee Hong; Jong Woo Kim
- Web page: https://patentgrep.com/patent/US11112352B2

## CPC

- G01N 21/1702: {with opto-acoustic detection, e.g. for gases or analysing solids}
- G01K 11/265: {using surface acoustic wave [SAW]}
- G01L 9/0025: {with acoustic surface waves}
- H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)}
- G01N 2021/1708: {with piezotransducers}
- H05K 1/181: associated with surface mounted components
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H05K 2201/0108: Transparent
- H05K 2201/10121: Optical component, e.g. opto-electronic component
- H05K 2201/10151: Sensor
- H05K 2203/1316: Moulded encapsulation of mounted components
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)
- G01K: MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR (radiation pyrometry G01J5/00)
- G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Provided are an optical sensor device using surface acoustic waves and an optical sensor device package. The optical sensor device includes: a substrate including a first light sensing area and a temperature sensing area and including a piezo electric material; a first input electrode and a first output electrode which are disposed in the first light sensing area and are apart from each other with a first delay gap therebetween; a first sensing film overlapping the first delay gap and configured to cover at least some portions of the first input electrode and the first output electrode; and a second input electrode and a second output electrode which are disposed in the temperature sensing area and are apart from each other with a second delay gap therebetween. The second delay gap is exposed to air.

## Claims

### Claim 1

An optical sensor package comprising:
a printed circuit board comprising a first bonding pad area and a second bonding pad area;
an optical sensor device disposed on the printed circuit board and connected to the first bonding pad area through wire bonding;
an integrated circuit (IC) chip disposed on the printed circuit board and connected to the second bonding pad area;
molding portions surrounding the optical sensor device and molding the second bonding pad area and the IC chip; and
a transparent substrate disposed on the molding portions and forming an air gap with the optical sensor device,
wherein the optical sensor device comprises:
a substrate comprising a first light sensing area and a temperature sensing area and comprising a piezo electric material;
a first input electrode and a first output electrode which are disposed in the first light sensing area and are apart from each other with a first delay gap between the first input electrode and the first output electrode;
a first sensing film overlapping the first delay gap and configured to cover at least some portions of the first input electrode and the first output electrode; and
a second input electrode and a second output electrode which are disposed in the temperature sensing area and are apart from each other with a second delay gap between the second input electrode and the second output electrode, and
wherein the second delay gap is exposed to air.

### Claim 2 (depends on 1)

The optical sensor device of claim 1, wherein the first input electrode is configured to receive a first electrical signal and provide a first input acoustic wave to the first light sensing area,
the first output electrode is configured to output a first output acoustic wave modulated by the first sensing film of which properties change according to external light,
the second input electrode is configured to receive a second electrical signal and provide a second input acoustic wave to the temperature sensing area, and
the second output electrode is configured to output a second output acoustic wave modulated by the substrate exposed to the air, wherein properties of the substrate exposed to the air change according to a temperature.

### Claim 3 (depends on 2)

The optical sensor device of claim 2, wherein the first output acoustic wave has a first peak and a second peak in a range from about 200 MHz to about 300 MHz,
a Q factor at the first peak is between about 200 and about 600, and
a difference between insertion losses of the first peak and the second peak is equal to or greater than 3 dB.

### Claim 4 (depends on 1)

The optical sensor device of claim 1, wherein the first input electrode and the first output electrode comprise Inter Digit Transducer (IDT) electrodes comprising a plurality of fingers having comb shapes, and
the first sensing film is configured to cover all of the plurality of fingers.

### Claim 5 (depends on 4)

The optical sensor device of claim 4, wherein a number of fingers comprised in the first input electrode and the first output electrode is between 35 and 121.

### Claim 6 (depends on 1)

The optical sensor device of claim 1, further comprising a ground electrode disposed between the first light sensing area and the temperature sensing area,
wherein the first input electrode and the second input electrode are symmetrically disposed with respect to the ground electrode.

### Claim 7 (depends on 1)

The optical sensor device of claim 1, wherein the first input electrode, the first output electrode, the second input electrode, and the second output electrode comprise a plurality of Inter Digit Transducer (IDT) fingers and a plurality of bar electrodes,
the first input electrode, the first output electrode, the second input electrode, and the second output electrode are aligned in a row on a side of the substrate, and
lengths of the plurality of bar electrodes of the first output electrode and the second output electrode are different from lengths of the plurality of bar electrodes of the first input electrode and the second input electrode.

### Claim 8 (depends on 1)

The optical sensor device of claim 1, wherein the first input electrode, the first output electrode, the second input electrode, and the second output electrode comprise a plurality of Inter Digit Transducer (IDT) electrodes comprising a plurality of IDT fingers and a plurality of bar electrodes, and
a first aperture, which is a length in which the plurality of IDT fingers comprised in the first input electrode cross and overlap each other; and
a second aperture, which is a length in which the plurality of IDT fingers comprised in the second electrode cross and overlap each other, wherein the first aperture is greater than the second aperture.

### Claim 9 (depends on 1)

The optical sensor device of claim 1, wherein the substrate comprises a second light sensing area that is close to the first light sensing area,
in the second light sensing area, a third input electrode, a third output electrode, which are apart from each other with a third delay gap between the third input electrode and the third output electrode, and a second sensing film configured to cover the third delay gap are disposed, and
one of the first sensing film and the second sensing film is configured to detect visible light, and the other of the first sensing film and the second sensing film is configured to detect ultraviolet rays.