# US 11,112,351 B2 · Partial submersion testing for plating defects > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,112,351 B2 - Document ID: US11112351B2 - Status: Granted - Kind: B2 - Application number: 16/571,311 - Filed: 2019-09-16 - Published: 2021-03-18 - Granted: 2021-09-07 - Earliest claimed: 2019-09-16 - Assignees: International Business Machines Corporation - Applicants: International Business Machines Corporation - Inventors: Eric J Campbell; James Anderl; Sarah K. Czaplewski-Campbell; Jason T. Wertz; Brandon M. Kobilka - Web page: https://patentgrep.com/patent/US11112351B2 ## CPC - G01N 19/08: Detecting presence of flaws or irregularities - G01N 21/954: Inspecting the inner surface of hollow bodies, e.g. bores - C25D 21/12: Process control or regulation (controlling or regulating in general G05) - G01N 21/91: using penetration of dyes, e.g. fluorescent ink - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 2201/09545: Plated through-holes or blind vias without lands - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A method and a system for detecting defects in plated-through hole by partially submerging a printed circuit board in a fluid bath. The method includes partially submerging a printed circuit board on a first side and measuring a capillary height difference within a plated-through hole and the surrounding fluid bath. The method further includes partially submerging the printed circuit board on a second side and measuring a second capillary height difference within the plated-through hole and the surrounding fluid bath. The method also includes comparing the measured values with predetermined values to determine the quality of the plated-through hole. ## Claims ### Claim 1 A method of detecting defects on a plated-through hole using a fluid bath, the method comprising: submerging, partially, a first side of a printed circuit board into a fluid bath to allow for capillary fluid to partially fill a plated-through hole on the printed circuit board; measuring a first meniscus height of the capillary fluid in the plated-through hole; and comparing the first meniscus height with a calibrated height to determine a quality of the plated-through hole. ### Claim 2 (depends on 1) The method of claim 1, further comprising: submerging, partially, a second side of the printed circuit board into the fluid bath to allow for the capillary fluid to partially fill the plated-through hole; measuring a second meniscus height of the capillary fluid in the plated-through hole; and comparing the second meniscus height with the calibrated height to determine the quality of the plated-through hole. ### Claim 3 (depends on 1) The method of claim 1, wherein the fluid bath is gradually filled to partially submerge the first side of the printed circuit board. ### Claim 4 (depends on 3) The method of claim 3, wherein measuring the first meniscus height is continuously measured as the fluid bath is gradually filled. ### Claim 5 (depends on 2) The method of claim 2, wherein the fluid bath is gradually filled to partially submerge the second side of the printed circuit board. ### Claim 6 (depends on 5) The method of claim 5, wherein measuring the second meniscus height is continuously measured as the fluid bath is gradually filled. ### Claim 7 (depends on 1) The method of claim 1, wherein the fluid bath contains dyes to improve measuring the first meniscus height. ### Claim 8 (depends on 1) The method of claim 1, further comprising: calculating a radius of the plated-through hole based on the first meniscus height; and determining whether the radius deviates from an expected radius for the plated-through hole. ### Claim 9 (depends on 2) The method of claim 2, further comprising: calculating a radius of the plated-through hole based on the second meniscus height; and determining whether the radius deviates from an expected radius for the plated-through hole. ### Claim 10 A computer program product for detecting defects on a plated-through hole using a fluid bath, the computer program product comprising a computer readable storage medium having program instruction embodied therewith, wherein the program instructions: submerge, partially, a first side of a printed circuit board into a fluid bath to allow for capillary fluid to partially fill a plated-through hole on the printed circuit board; measure a first meniscus height of the capillary fluid in the plated-through hole; and compare the first meniscus height with a calibrated height to determine a quality of the plated-through hole. ### Claim 11 (depends on 10) The computer program product of claim 10, further comprising instructions to: submerge, partially, a second side of the printed circuit board into the fluid bath to allow for the capillary fluid to partially fill the plated-through hole; measure a second meniscus height of the capillary fluid in the plated-through hole; and compare the second meniscus height with the calibrated height to determine the quality of the plated-through hole. ### Claim 12 (depends on 10) The computer program product of claim 10, wherein the fluid bath is gradually filled to partially submerge the first side of the printed circuit board. ### Claim 13 (depends on 12) The computer program product of claim 12, wherein the instructions to measure the first meniscus height is continuously measured as the fluid bath is gradually filled. ### Claim 14 (depends on 11) The computer program product of claim 11, wherein the fluid bath is gradually filled to partially submerge the second side of the printed circuit board. ### Claim 15 (depends on 14) The computer program product of claim 14, wherein the instructions to measure the second meniscus height is continuously measured as the fluid bath is gradually filled. ### Claim 16 (depends on 10) The computer program product of claim 10, wherein the fluid bath contains dyes to improve measuring the first meniscus height. ### Claim 17 (depends on 10) The computer program product of claim 10, further comprising instructions to: calculate a radius of the plated-through hole based on the first meniscus height; and determine whether the radius deviates from an expected radius for the plated-through hole. ### Claim 18 (depends on 11) The computer program product of claim 11, further comprising instructions to: calculate a radius of the plated-through hole based on the second meniscus height; and determine whether the radius deviates from an expected radius for the plated-through hole. ### Claim 19 A system, comprising: a processor; a memory to store instruction, which when executed from the memory, cause the processor to perform operations, submerge, partially, a first side of a printed circuit board into a fluid bath to allow for capillary fluid to partially fill a plated-through hole on the printed circuit board; measure a first meniscus height of the capillary fluid in the plated-through hole; and compare the first meniscus height with a calibrated height to determine a quality of the plated-through hole. ### Claim 20 (depends on 19) The system of claim 19, further comprising operations: submerge, partially, a second side of the printed circuit board into the fluid bath to allow for the capillary fluid to partially fill the plated-through hole; measure a second meniscus height of the capillary fluid in the plated-through hole; and compare the second meniscus height with the calibrated height to determine the quality of the plated-through hole.