Method for determining a strength of a bond and/or a material as well as a bond tester apparatus
AssigneeXyztec B.V. [Nl/Nl]
InventorRobert John Sykes
Life of this patent
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Abstract
A method for testing a bond using a bond tester apparatus, the method comprising the steps of applying a mechanical force to the bond, determining, by a sensor component comprised by the bond tester apparatus, the applied force to the bond by measuring, by the sensor component, a displacement of the sensor component caused by the applied force and calculating, by the sensor component, the applied force on the basis of a first component which comprises a direct relationship with the measured displacement and on the basis of at least one of a second component, a third component and a fourth component.
Claims7
A method for performing an application of force on a bond, comprising the steps of:
- applying, using a test tool comprising a bond tester apparatus, a mechanical force to the bond;
- determining, by a sensor component of the bond tester apparatus, the applied force to the bond by:
- measuring, by the sensor component, a displacement of the sensor component caused by the applied force;
- and
- calculating, by the sensor component, the applied force on the basis of a first component which comprises a direct relationship with the measured displacement and on the basis of at least one of:
- a second component which comprises a direct relationship with a first derivative of the measured displacement over time;
- a third component which comprises a direct relationship with a second derivative of the measured displacement over time;
- and
- a fourth component which comprises a direct relationship with an acceleration of the sensor component;
- wherein the first component comprises a spring coefficient times the measured displacement;
- and
- wherein the spring coefficient is related to a constant characteristic of the sensor component.
Dependencies are inferred from the claim text.