# US 11,112,103 B2 · In mold electronic printed circuit board encapsulation and assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,112,103 B2 - Document ID: US11112103B2 - Status: Granted - Kind: B2 - Application number: 16/184,202 - Filed: 2018-11-08 - Published: 2019-03-28 - Granted: 2021-09-07 - Earliest claimed: 2013-04-19 - Assignees: Covestro LLC; Thermal Solution Resources, LLC - Applicants: Covestro LLC; Thermal Solution Resources, LLC - Inventors: Terry G. Davis; David Rocco; Mikhail Sagal; Jessee McCanna; Nicolas Sunderland; James Lorenzo; Mark Matsco; Kevin Dunay - Web page: https://patentgrep.com/patent/US11112103B2 ## CPC - F21V 29/87: Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor - B29C 67/246: {Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM] (casting monomers B29C39/006, mixing construction B29B7/74)} - F21K 9/23: Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings - F21K 9/90: Methods of manufacture - F21V 23/006: {the substrate being distinct from the light source holder} - F21V 29/773: {the planes containing the fins or blades having the direction of the light emitting axis} - B29K 2075/00: Use of {PU, i.e.} polyureas or polyurethanes {or derivatives thereof}, as moulding material - B29K 2669/00: Use of {PC, i.e.} polycarbonates {or derivatives thereof} for preformed parts, e.g. for inserts - B29K 2995/0013: Conductive - B29L 2031/3425: {Printed circuits} - F21V 31/04: Provision of filling media - F21Y 2105/10: comprising a two-dimensional [2D] array of point-like light-generating elements - F21Y 2115/10: Light-emitting diodes [LED] - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step. ## Claims ### Claim 1 An assembly comprising: a heat sink consisting of a thermally conductive thermoplastic polymer composition; a first electrical/electronic component; a second electrical/electronic component different from the first electrical/electronic component; and a polyurethane, wherein the heat sink partially or fully surrounds the first electrical/electronic component, wherein the polyurethane encapsulates the second electrical/electronic components to form the assembly, wherein the first electrical/electronic component is insert molded into the heat sink, and wherein the polyurethane is bonded to the heat sink. ### Claim 2 (depends on 1) The assembly according to claim 1, wherein the thermally conductive thermoplastic polymer composition contains an amorphous thermoplastic polymer selected from the group consisting of polypropylene, cyclic olefin copolymers, polycarbonate, polymethylmethacrylate and polystyrene. ### Claim 3 (depends on 2) The assembly according to claim 2, wherein the thermally conductive thermoplastic polymer composition comprises polycarbonate. ### Claim 4 (depends on 1) The assembly according to claim 1, wherein the first and second electrical/electronic components are each selected from the group consisting of a printed circuit board, a light emitting diode (LED), a resistor, a constant current driver, a driver/controller, a capacitor, a microprocessor, an integrated circuit, a photocell, a piezo-transducer, an inductor, and a proximity switch. ### Claim 5 (depends on 4) The assembly according to claim 4, wherein the first electrical/electronic component is selected from the group consisting of a light emitting diode (LED), a resistor, a constant current driver, a capacitor, a microprocessor, an integrated circuit, a photocell, a piezo-transducer, an inductor, and a proximity switch. ### Claim 6 (depends on 4) The assembly according to claim 4, wherein the second electrical/electronic component is a printed circuit board or a driver/controller. ### Claim 7 (depends on 4) The assembly according to claim 4, wherein the first electrical/electronic component comprises a light emitting diode and the second electrical/electronic component comprises a driver/controller. ### Claim 8 (depends on 1) The assembly according to claim 1 further comprising at least one of a power supply and a threaded connector. ### Claim 9 A process of making an assembly comprising: partially or fully surrounding a first electrical/electronic component with a heat sink consisting of a thermally conductive thermoplastic polymer; encapsulating a second electrical/electronic component with a reaction injection molded polyurethane; and forming the assembly by interlocking the reaction injection molded polyurethane with the heat sink, wherein the second electrical/electronic component is different from the first electrical/electronic component, wherein the first electrical/electronic component is insert molded into the heat sink, and wherein the polyurethane is bonded to the heat sink. ### Claim 10 (depends on 9) The process according to claim 9, wherein the thermally conductive thermoplastic polymer composition comprises an amorphous thermoplastic polymer selected from the group consisting of polypropylene, cyclic olefin copolymers, polycarbonate, polymethylmethacrylate and polystyrene. ### Claim 11 (depends on 10) The process according to claim 10, wherein the thermally conductive thermoplastic polymer composition comprises polycarbonate. ### Claim 12 (depends on 9) The process according to claim 9, wherein the first and second electrical/electronic components are each selected from the group consisting of a printed circuit board, a light emitting diode (LED), a resistor, a constant current driver, a driver/controller, a capacitor, a microprocessor, an integrated circuit, a photocell, a piezo-transducer, an inductor, and a proximity switch. ### Claim 13 (depends on 12) The process according to claim 12, wherein the first electrical/electronic component is selected from the group consisting of a light emitting diode (LED), a resistor, a constant current driver, a capacitor, a microprocessor, an integrated circuit, a photocell, a piezo-transducer, an inductor, and a proximity switch. ### Claim 14 (depends on 12) The process according to claim 12, wherein the second electrical/electronic component is a printed circuit board or a driver/controller. ### Claim 15 (depends on 12) The process according to claim 12, wherein the first electrical/electronic component comprises a light emitting diode and the second electrical/electronic component comprises a driver/controller. ### Claim 16 (depends on 12) The process according to claim 12, further comprising a step of inserting a power supply into a polyurethane reaction injection mold before reaction injection molding the polyurethane.