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US 11,111,414 B2Granted
Polishing composition
AssigneeFujimi Incorporated
InventorYusuke Kadohashi
Life of this patent
Estimating the term…
Abstract
A polishing composition having a pH of less than 7, comprising an abrasive grain and an amide compound, wherein the amide compound has a group forming a Σ conjugated system with a carbonyl group.
Claims9
A polishing composition having a pH of less than 7, consisting of an abrasive grain, an amide compound, a dispersing medium or solvent, and a pH adjusting agent, wherein the amide compound has a group forming a π conjugated system with a carbonyl group.
Dependencies are inferred from the claim text.