# US 11,111,407 B2 · Sealing resin composition, electronic component device, and method of manufacturing electronic component device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,111,407 B2 - Document ID: US11111407B2 - Status: Granted - Kind: B2 - Application number: 16/341,764 - Filed: 2017-09-26 - Published: 2019-08-01 - Granted: 2021-09-07 - Earliest claimed: 2016-10-14 - Assignees: Showa Denko Materials Co., Ltd. - Applicants: Hitachi Chemical Company, Ltd. - Inventors: Yuma Takeuchi; Hisato Takahashi; Yoshihito Inaba - Web page: https://patentgrep.com/patent/US11111407B2 ## CPC - C09D 163/00: Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins - C08G 59/50: Amines - C08K 3/00: Use of inorganic substances as compounding ingredients - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - C09D 7/61: inorganic - H01L 21/56 - H01L 23/29 - H01L 23/295 - H01L 23/31 - H01L 23/3121 - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H01L ## Abstract A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more. ## Claims ### Claim 1 A sealing resin composition comprising: an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein: the inorganic filler (C) comprises a first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 m2/g or more, and the sealing resin composition has a viscosity, at 25° C., from 0.1 Pa·s to 50.0 Pa·s. ### Claim 2 (depends on 1) The sealing resin composition according to claim 1, having a viscosity, at 110° C., of 0.20 Pa·s or less. ### Claim 3 (depends on 1) The sealing resin composition according to claim 1, wherein a proportion of the second inorganic filler (C2) having an average particle size from 10 nm to 80 nm in the inorganic filler (C) is 0.3% by mass or more. ### Claim 4 (depends on 1) The sealing resin composition according to claim 1, wherein a proportion of the second inorganic filler (C2) having an average particle size from 10 nm to 80 nm in the inorganic filler (C) is 30% by mass or less. ### Claim 5 (depends on 1) The sealing resin composition according to claim 1, wherein a proportion of the first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm in the inorganic filler (C) is 70% by mass or more. ### Claim 6 (depends on 1) The sealing resin composition according to claim 1, wherein the first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm comprises silica. ### Claim 7 (depends on 1) The sealing resin composition according to claim 1, wherein the second inorganic filler (C2) having an average particle size from 10 nm to 80 nm comprises silica. ### Claim 8 (depends on 1) The sealing resin composition according to claim 1, wherein a content of the inorganic filler (C) is from 40% by mass to 85% by mass. ### Claim 9 (depends on 1) The sealing resin composition according to claim 1, wherein a specific surface area of the first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm is from 1 m2/g to 30 m2/g. ### Claim 10 (depends on 1) The sealing resin composition according to claim 1, wherein a specific surface area of the second inorganic filler (C2) having an average particle size from 10 nm to 80 nm is from 20 m2/g to 500 m2/g. ### Claim 11 (depends on 1) The sealing resin composition according to claim 1, having a thixotropic index, at 25° C., from 0.5 to 1.5. ### Claim 12 (depends on 1) The sealing resin composition according to claim 1, wherein the sealing resin composition has a viscosity, at 25° C., from 0.1 Pa·s to 20.0 Pa·s. ### Claim 13 (depends on 1) The sealing resin composition according to claim 1, wherein the sealing resin composition has a viscosity, at 25° C., from 0.1 Pa·s to 10.0 Pa·s. ### Claim 14 (depends on 1) The sealing resin composition according to claim 1, wherein the epoxy resin (A) comprises an epoxy resin that is liquid at 25° C. ### Claim 15 (depends on 1) An electronic component device comprising: a substrate having a circuit layer, an electronic component disposed on the substrate and electrically connected to the circuit layer, and a cured product of the sealing resin composition according to claim 1, disposed in a gap between the substrate and the electronic component. ### Claim 16 (depends on 1) A method of manufacturing an electronic component device, comprising: a step of sealing, with the sealing resin composition according to claim 1, a substrate having a circuit layer and an electronic component disposed on the substrate and electrically connected to the circuit layer.