# US 11,111,382 B2 · Epoxy resin composition

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- Number: US 11,111,382 B2
- Document ID: US11111382B2
- Status: Granted
- Kind: B2
- Application number: 16/476,721
- Filed: 2018-01-09
- Published: 2019-11-28
- Granted: 2021-09-07
- Earliest claimed: 2017-01-10
- Assignees: Sumitomo Seika Chemicals Co., Ltd.
- Applicants: Sumitomo Seika Chemicals Co., Ltd.
- Inventors: Noriaki Fukuda; Ryota Harisaki; Katsumasa Yamamoto
- Web page: https://patentgrep.com/patent/US11111382B2

## CPC

- C08L 71/12: Polyphenylene oxides
- C08G 59/02: Polycondensates containing more than one epoxy group per molecule
- C08G 59/306: {containing silicon}
- C08G 59/3281: {containing silicon}
- C08G 59/4215: {cycloaliphatic}
- C08G 59/686: {containing nitrogen}
- C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- H05K 1/0326: {containing O}
- H05K 3/4676: {Single layer compositions}
- H05K 2201/0162: Silicon containing polymer, e.g. silicone
- H10W 74/47: comprising organic materials, e.g. plastics or resins
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is an epoxy resin composition having excellent low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising a polyphenylene ether and an epoxy resin having a specific structure.

## Claims

### Claim 1

An epoxy resin composition comprising an epoxy resin and a polyphenylene ether, the epoxy resin being represented by the formula (1):
wherein X ring is a saturated hydrocarbon ring or an unsaturated hydrocarbon ring, or rings having a structure in which 2 to 6 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are condensed, or in which 2 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are connected;
RXa, RXb, RXc, and RXd are the same or different, and each is a hydrogen atom, a lower alkyl group, a lower alkoxy group, a lower alkenyl group, a halogen atom, or a group represented by the formula (3):
wherein R1 is the same or different, and is a C1-18 alkyl group, a C2-9 alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;
R2 is a C1-18 alkylene group, wherein one or more carbon atoms of this group other than a carbon atom directly bonded to a silicon atom may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;
R3 is the same or different, and is a C1-18 alkyl group, a C2-9 alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;
m is an integer of 0 to 6; and
n is an integer of 0 to 3;
provided that at least one of RXa, RXb, RXc, and RXd is a group represented by the formula (3); and
one or more hydrogen atoms bonded to one or more carbon atoms that constitute the hydrocarbon ring constituting the X ring, and that are not bonded to RXa, RXb, RXc, or RXd, may be replaced by a lower alkyl group, a lower alkoxy group, a lower alkenyl group, or a halogen atom.

### Claim 2 (depends on 1)

The epoxy resin composition according to claim 1, wherein the rings having a structure in which 2 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are connected are rings represented by the formula (2):
wherein X1 ring and X2 ring are the same or different, and each is a saturated hydrocarbon ring or an unsaturated hydrocarbon ring; and
Y is a bond, a C1-6 alkylene group that may be substituted with a C1-4 alkyl group, an oxygen atom (—O—), a sulfur atom (—S—), —SO—, or —SO2—.

### Claim 3 (depends on 1)

The epoxy resin composition according to claim 1, wherein the saturated hydrocarbon ring is a C4-8 saturated hydrocarbon ring, and the unsaturated hydrocarbon ring is a C4-8 unsaturated hydrocarbon ring.

### Claim 4 (depends on 1)

The epoxy resin composition according to claim 1, wherein the epoxy resin is at least one epoxy resin selected from the group consisting of:
an epoxy resin represented by the formula (1-iia):
wherein Xii is a divalent group obtained by removing two hydrogen atoms from a saturated hydrocarbon ring or an unsaturated hydrocarbon ring, or from rings having a structure in which 2 to 6 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are condensed; or a divalent group represented by the formula (2g-iia):
wherein Y is a bond, a C1-6 alkylene group that may be substituted with a C1-4 alkyl group, an oxygen atom (—O—), a sulfur atom (—S—), —SO—, or —SO2—;
R1 is the same or different, and is a C1-18 alkyl group, a C2-9 alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;
R2 is the same or different, and is a C1-18 alkylene group, wherein one or more carbon atoms of this group other than a carbon atom directly bonded to a silicon atom may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;
R3 is the same or different, and is a C1-18 alkyl group, a C2-9 alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;
m is an integer of 0 to 6; and
n is an integer of 0 to 3; and
an epoxy resin represented by the formula (1-iiia):
wherein Xiii is a trivalent group obtained by removing three hydrogen atoms from a saturated hydrocarbon ring or an unsaturated hydrocarbon ring, or from rings having a structure in which 2 to 6 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are condensed; or a trivalent group represented by the formula (2g-iiia):
wherein Y is as defined above; and
R1, R2, R3, m, and n are as defined above.

### Claim 5 (depends on 4)

A cured product of the epoxy resin composition according to claim 4.

### Claim 6 (depends on 5)

A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay film, an electromagnetic shielding film, a printed circuit board material, or a composite material, each of which uses the cured product according to claim 5.

### Claim 7 (depends on 4)

A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay film, an electromagnetic shielding film, a printed circuit board material, or a composite material, each of which uses the epoxy resin composition according to claim 4.

### Claim 8 (depends on 4)

The epoxy resin composition according to claim 4, wherein the epoxy resin is at least one epoxy resin selected from the group consisting of:
an epoxy resin represented by the formula (1-IIa):
wherein R1, R2, and Xii are as defined above,
an epoxy resin represented by the formula (1-IIb):
wherein R1, R2, R3, Xii, and n are as defined above, and
an epoxy resin represented by the formula (1-IIIa):
wherein R1, R2, R3, Xiii, and n are as defined above.

### Claim 9 (depends on 8)

A cured product of the epoxy resin composition according to claim 8.

### Claim 10 (depends on 9)

A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay film, an electromagnetic shielding film, a printed circuit board material, or a composite material, each of which uses the cured product according to claim 9.

### Claim 11 (depends on 8)

A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay film, an electromagnetic shielding film, a printed circuit board material, or a composite material, each of which uses the epoxy resin composition according to claim 8.

### Claim 12 (depends on 1)

The epoxy resin composition according to claim 1, wherein the polyphenylene ether has a reactive functional group equivalent of 200 to 5,000 g/eq.

### Claim 13 (depends on 1)

A cured product of the epoxy resin composition according to claim 1.

### Claim 14 (depends on 13)

A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay film, an electromagnetic shielding film, a printed circuit board material, or a composite material, each of which uses the cured product according to claim 13.

### Claim 15 (depends on 1)

A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay film, an electromagnetic shielding film, a printed circuit board material, or a composite material, each of which uses the epoxy resin composition according to claim 1.