# US 11,111,348 B2 · Method for treating surface of resin material layer and resin material

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- Number: US 11,111,348 B2
- Document ID: US11111348B2
- Status: Granted
- Kind: B2
- Application number: 16/305,155
- Filed: 2017-03-31
- Published: 2020-10-08
- Granted: 2021-09-07
- Earliest claimed: 2016-05-31
- Assignees: Mitsubishi Heavy Industries, Ltd.; National University Corporation Kobe University
- Applicants: Mitsubishi Heavy Industries, Ltd.; National University Corporation KOBE University
- Inventors: Koichi Hasegawa; Toshio Abe; Kiyoka Takagi; Takashi Nishino; Takuya Matsumoto; Akira Miyagaki
- Web page: https://patentgrep.com/patent/US11111348B2

## CPC

- C08J 7/12: Chemical modification
- C08J 7/126: {Halogenation}
- C08J 2371/00: Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)

## Abstract

A method is for treating a surface of a resin material layer. The method includes a first step of introducing as a substituent at least one selected from the group consisting of an acid halide and an alkyl halide into an aromatic polyether-based resin included in the resin material layer by Friedel-Crafts reaction.

## Claims

### Claim 1

A method for treating a surface of a resin material layer, the method comprising a first step of introducing as a substituent a compound for substitution reaction that is at least one selected from the group consisting of an acid halide and an alkyl halide into an aromatic polyether-based resin included in the resin material layer by Friedel-Crafts reaction.

### Claim 2 (depends on 1)

The method for treating a surface of a resin material layer according to claim 1, wherein the substituent has an unsaturated bond.

### Claim 3 (depends on 1)

The method for treating a surface of a resin material layer according to claim 1, wherein the aromatic polyether-based resin includes at least one selected from the group consisting of an aromatic polyetherketone, an aromatic polyetheretherketone, an aromatic polyetherketoneketone, an aromatic polyetheretherketoneketone, an aromatic polyetherketone ester, and an aromatic polyethersulfone.

### Claim 4 (depends on 1)

The method for treating a surface of a resin material layer according to claim 1, wherein the acid halide is an acid halide having a carbon number of 5 to 15.

### Claim 5 (depends on 1)

The method for treating a surface of a resin material layer according to claim 1, further comprising a second step of introducing a hydrophilic functional group into the substituent.

### Claim 6 (depends on 5)

The method for treating a surface of a resin material layer according to claim 5, wherein, at the second step, the hydrophilic functional group is introduced by epoxidizing an unsaturated bond in the substituent.