US 11,111,132 B2 · Micro electromechanical systems (MEMS)inertial sensor

Abstract

An micro electro mechanical sensor comprising: a substrate; and a sensor element movably mounted to a first side of said substrate; wherein a second side of said substrate has a pattern formed in relief thereon. The pattern formed in relief on the second side of the substrate provides a reduced surface area for contact with the die bond layer. The reduced surface area reduces the amount of stress that is transmitted from the die bond layer to the substrate (and hence reduces the amount of transmitted stress reaching the MEMS sensor element). Because the substrate relief pattern provides a certain amount of stress decoupling, the die bond layer does not need to decouple the stress to the same extent as in previous designs. Therefore a thinner die bond layer can be used, which in turn allows the whole package to be slightly thinner.

Claims10

Dependent claims

A micro electromechanical systems (MEMS) sensor that is an accelerometer or a gyroscope comprising:

a substrate;
and
a sensor element movably mounted to a first side of said substrate;
wherein a second side of said substrate has a pattern formed in relief thereon;
and
wherein the sensor element has a rotational symmetry and wherein the pattern has a rotational symmetry that substantially corresponds to the symmetry of the sensor element to minimize the effect of stress transfer on the sensor operation;
and
wherein the pattern comprises a set of radially oriented ribs.

5 more elements

Dependencies are inferred from the claim text.

Micro electromechanical systems (MEMS)inertial sensor

Life of this patent

Micro electromechanical systems (MEMS)inertial sensor

Life of this patent

Abstract

Claims10