# US 11,111,131 B2 · MEMS microphone, a manufacturing method thereof and an electronic apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,111,131 B2 - Document ID: US11111131B2 - Status: Granted - Kind: B2 - Application number: 16/619,980 - Filed: 2017-06-09 - Published: 2021-03-18 - Granted: 2021-09-07 - Earliest claimed: 2017-06-09 - Assignees: Goertek Inc. - Applicants: Goertek. Inc - Inventors: Quanbo Zou - Web page: https://patentgrep.com/patent/US11111131B2 ## CPC - B81B 3/0018: {Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators} - B81B 7/0029: {Protection against environmental influences not provided for in groups B81B7/0012 - B81B7/0025} - H04R 19/04: Microphones (H04R19/01 takes precedence) - H04R 31/006: {Interconnection of transducer parts (of diaphragm and outer suspension by moulding H04R31/003)} - B81B 2201/0257: Microphones or microspeakers - B81B 2203/0127: Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function - B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package - H04R 19/005: {using semiconductor materials} - H04R 2201/003: Mems transducers or their use - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) ## Abstract A MEMS microphone, a manufacturing method thereof and an electronic apparatus are disclosed. The MEMS microphone comprises: a MEMS microphone device including a MEMS microphone chip and a mesh membrane monolithically integrated with the MEMS microphone chip; and a housing including an acoustic port, wherein the MEMS microphone device is mounted in the housing, and the mesh membrane is arranged between the MEMS microphone chip and the acoustic port as a particle filter for the MEMS microphone chip. ## Claims ### Claim 1 A method for manufacturing a MEMS microphone, including: preparing a MEMS microphone wafer, wherein the sacrificial layer between a diaphragm and a backplate of the MEMS microphone wafer are not released; preparing a mesh wafer, wherein a mesh membrane is formed on the mesh wafer; bonding the MEMS microphone wafer with the mesh wafer; forming a back hole for the mesh membrane in the mesh wafer; etching the sacrificial layer in the MEMS microphone wafer to release the diaphragm and the back plate; singulating the MEMS microphone wafer and the mesh wafer to form a MEMS microphone device including a MEMS microphone chip and a monolithically integrated mesh membrane; and mounting the MEMS microphone device in a housing, wherein the housing has an acoustic port, and the mesh membrane is arranged between the MEMS microphone chip and the acoustic port as a particle filter for the MEMS microphone chip. ### Claim 2 (depends on 1) An MEMS microphone manufactured through the method of claim 1. ### Claim 3 (depends on 2) The MEMS microphone according to claim 2, wherein the MEMS microphone chip includes a first substrate, at least one backplate and at least one diaphragm, and the mesh membrane is formed on a second substrate; and wherein the mesh membrane and the second substrate are bonded to the first substrate. ### Claim 4 (depends on 3) The MEMS microphone according to claim 3, wherein the mesh membrane and the second substrate are bonded to the first substrate by at least one of wafer bonding, fusion bonding and intermediate layer bonding. ### Claim 5 (depends on 2) The MEMS microphone according to claim 2, wherein the housing includes a package substrate and a lid, which form a housing cavity, and the acoustic port is in the package substrate. ### Claim 6 (depends on 2) The MEMS microphone according to claim 2, wherein the mesh membrane has a perforation hole size of 1-10 um, and the mesh membrane has a thickness in range of 0.1-10 um. ### Claim 7 (depends on 2) The MEMS microphone according to claim 2, wherein a material of the mesh membrane is at least one of SixNy, polySi, metal, alloy and polymer. ### Claim 8 (depends on 1) The method according to claim 1, wherein preparing a mesh wafer further includes: placing a bonding layer on the mesh membrane, and wherein the MEMS microphone wafer is bonded with the mesh wafer via the bonding layer, and forming a back hole for the mesh membrane in the mesh wafer further includes: etching the bonding layer to release the mesh membrane. ### Claim 9 (depends on 2) An electronic apparatus, which comprises a MEMS microphone according to claim 2. ### Claim 10 (depends on 1) An electronic apparatus, which comprises a MEMS microphone manufactured by using the method according to claim 1.