# US 11,110,685 B2 · Integrally molded body and method of producing same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 11,110,685 B2
- Document ID: US11110685B2
- Status: Granted
- Kind: B2
- Application number: 16/468,198
- Filed: 2017-11-30
- Published: 2019-12-26
- Granted: 2021-09-07
- Earliest claimed: 2016-12-12
- Assignees: Toray Industries, Inc.
- Applicants: Toray Industries, Inc.
- Inventors: Hideaki Sasaki; Yuki Takahashi; Keisuke Shiozaki
- Web page: https://patentgrep.com/patent/US11110685B2

## CPC

- B29C 45/14377: {using an additional insert, e.g. a fastening element}
- B32B 5/26: another layer {next to it} also being fibrous or filamentary {(relative arrangement of fibres or filaments of different layers B32B5/12)}
- B29C 45/14065: {Positioning or centering articles in the mould}
- B29C 45/14508: {Joining juxtaposed sheet-like articles, e.g. for making trim panels}
- B29C 45/14778: {the article consisting of a material with particular properties, e.g. porous, brittle}
- B32B 3/04: characterised by {at least one} layer folded at the edge, e.g. over another layer {; characterised by at least one layer enveloping or enclosing a material}
- B32B 5/02: characterised by structural features of a {fibrous or filamentary} layer {(layer formed of metallic wires B32B15/02; layer formed of natural mineral fibres B32B19/02; layer formed of wood fibres B32B21/02)}
- B32B 5/18: characterised by features of a layer {of} foamed material
- B32B 5/245: {another layer next to it being a foam layer}
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 15/046: {of foam}
- B32B 15/082: comprising vinyl resins; comprising acrylic resins
- B32B 15/085: comprising polyolefins
- B32B 15/088: comprising polyamides
- B32B 15/09: comprising polyesters
- B32B 15/092: comprising epoxy resins
- B32B 15/095: comprising polyurethanes
- B32B 15/098: comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
- B32B 15/14: next to a fibrous or filamentary layer
- B32B 15/18: comprising iron or steel {(B32B15/011, B32B15/012 and B32B15/013 take precedence)}
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- B32B 27/065: {of foam}
- B32B 27/08: of synthetic resin
- B32B 27/20: using fillers, pigments, thixotroping agents
- B32B 27/281: {comprising polyimides}
- B32B 27/285: {comprising polyethers}
- B32B 27/286: {comprising polysulphones; polysulfides}
- B32B 27/288: {comprising polyketones}
- B32B 27/302: {comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers}
- B32B 27/304: {comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF}
- B32B 27/308: {comprising acrylic (co)polymers}
- B32B 27/32: comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)}
- B32B 27/322: {comprising halogenated polyolefins, e.g. PTFE}
- B32B 27/34: comprising polyamides
- B32B 27/36: comprising polyesters
- B32B 27/365: {comprising polycarbonates}
- B32B 27/38: comprising epoxy resins
- B32B 27/40: comprising polyurethanes
- B32B 27/42: comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
- B29C 2045/1454: {injecting between inserts not being in contact with each other}
- B29K 2077/00: Use of {PA, i.e.} polyamides, e.g. polyesteramides {or derivatives thereof}, as moulding material
- B29K 2309/08: Glass
- B29L 2012/00: Frames
- B29L 2031/3481: {Housings or casings incorporating or embedding electric or electronic elements}
- B32B 2250/02: 2 layers
- B32B 2260/021: Fibrous or filamentary layer
- B32B 2260/046: Synthetic resin
- B32B 2262/0246: Acrylic resin fibres
- B32B 2262/0253: Polyolefin fibres
- B32B 2262/0261: Polyamide fibres
- B32B 2262/0269: Aromatic polyamide fibres
- B32B 2262/0276: Polyester fibres
- B32B 2262/04: Cellulosic plastic fibres, e.g. rayon
- B32B 2262/101: Glass fibres
- B32B 2262/105: Ceramic fibres
- B32B 2262/106: Carbon fibres, e.g. graphite fibres
- B32B 2266/0228: Aromatic vinyl resin, e.g. styrenic (co)polymers
- B32B 2266/0235: Vinyl halide, e.g. PVC, PVDC, PVF, PVDF
- B32B 2266/0242: Acrylic resin
- B32B 2266/025: Polyolefin
- B32B 2266/0278: Polyurethane
- B32B 2266/0285: Condensation resins of aldehydes, e.g. with phenols, ureas, melamines
- B32B 2274/00: Thermoplastic elastomer material
- B32B 2307/538: Roughness
- B32B 2439/62: Boxes, cartons, cases
- B32B 2457/00: Electrical equipment
- B32B 2605/003: Interior finishings
- Y10T 428/24777: Edge feature
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An integrally molded body has a bonding resin (C) interposed between a board (A) and a member (B), one surface of the board being a design surface, wherein: inside the member (B), a first bonding section disposed to space apart the board (A) and the member (B) and by which at least a partial region of an outer peripheral edge section of the board (A) bonds to the bonding resin (C), is provided; and at least at a part of the design surface-side surface of the integrally molded body, a region where the board (A), the member (B), and the bonding resin (C) are exposed is provided. A plurality of structures can be bonded with high bonding strength and allows for the bonding boundary thereof to have favorable smoothness, thereby making it possible to mitigate warping and reduce weight and thickness even when the molded body has a board constituent member.

## Claims

### Claim 1

An integrally molded body comprising:
a board (A),
a member (B), and
an injection molded bonding resin (C) interposed between the board (A) whose one surface is a design surface and the member (B),
wherein, inside the member (B), a first bonding section is disposed to space apart the board (A) and the member (B) and by which at least a partial region of an outer peripheral edge section of the board (A) bonds to the injection molded bonding resin (C), and
at least a part of the design surface-side surface of the integrally molded body has a region where the board (A), the member (B), and the injection molded bonding resin (C) are exposed, wherein 1) the board (A) has a member composed of at least one of a fiber reinforced resin member comprising reinforcing fibers and a thermosetting resin and a metal member, and 2) the board (A) has a sandwich structure sandwiching both surfaces of a core layer with skin layers each of which includes the member composed of at least one of a fiber reinforced resin member comprising reinforcing fibers and a thermosetting resin and a metal member, and the core layer is selected from a thermoplastic resin, a foam, and a porous base material comprising discontinuous fibers and a thermoplastic resin,
wherein a thermoplastic resin layer (D) is further provided on an outer surface of the board (A), and the board (A) and the injection molded bonding resin (C) are bonded via the thermoplastic resin layer (D).

### Claim 2 (depends on 1)

The integrally molded body according to claim 1, wherein the first bonding section is formed over an entire circumference of an outer peripheral edge section of the board (A).

### Claim 3 (depends on 1)

The integrally molded body according to claim 1, wherein the board (A) and the member (B) include a region overlapping via the injection molded bonding resin (C).

### Claim 4 (depends on 1)

The integrally molded body according to claim 1, wherein the injection molded bonding resin (C) is a thermoplastic resin.

### Claim 5 (depends on 1)

The integrally molded body according to claim 1, wherein the member (B) is a metal frame.

### Claim 6 (depends on 1)

The integrally molded body according to claim 1, wherein the member (B) is a fiber reinforced resin comprising reinforcing fibers and a resin.

### Claim 7 (depends on 1)

The integrally molded body according to claim 1, wherein the member (B) is a frame member having a standing wall shape portion in at least a part of the member (B).

### Claim 8 (depends on 1)

The integrally molded body according to claim 1, wherein a fitting portion, into which the injection molded bonding resin (C) enters, is provided in a part of the core layer composed of either the foam or the porous base material comprising discontinuous fibers and a thermoplastic resin.

### Claim 9 (depends on 1)

The integrally molded body according to claim 1, wherein a stepped portion is provided between the first bonding section and a region other than the first bonding section of the board (A) whose core layer is the porous base material, and the stepped portion has an inclined surface of 10° to 90° with respect to the in-plane direction of the board (A).

### Claim 10 (depends on 9)

The integrally molded body according to claim 9, wherein the porosity of the porous base material in the first bonding section is lower than the porosity of the porous base material in the region other than the first bonding section.

### Claim 11 (depends on 1)

A method of producing the integrally molded body accordingly to claim 1 comprising at least steps [1] and [2]:
[1] placing a board (A), whose one surface is a design surface, inside a member (B) having a frame shape, at a condition where at least a part of the board (A) is apart from the member (B), and
[2] bonding and integrating the board (A) and the member (B) with each other at least at an outer peripheral edge section of the board (A) by injection molding a bonding resin (C) into a space between the board (A) and the member (B).

### Claim 12 (depends on 11)

The method according to claim 11, wherein at least a part of the surface of the integrally molded body on the design surface side is formed as a region where the board (A), the member (B), and the bonding resin (C) are exposed, by injection molding the bonding resin (C) into the space from an opposite side of the design surface.

### Claim 13

An integrally molded body comprising:
a board (A),
a member (B), and
an injection molded bonding resin (C) interposed between the board (A) whose one surface is a design surface and the member (B),
wherein, inside the member (B), a first bonding section is disposed to space apart the board (A) and the member (B) and by which at least a partial region of an outer peripheral edge section of the board (A) bonds to the injection molded bonding resin (C),
at least a part of the design surface-side surface of the integrally molded body has a region where the board (A), the member (B), and the injection molded bonding resin (C) are exposed, wherein 1) the board (A) has a member composed of at least one of a fiber reinforced resin member comprising reinforcing fibers and a thermosetting resin and a metal member, and 2) the board (A) has a sandwich structure sandwiching both surfaces of a core layer with skin layers each of which includes the member composed of at least one of a fiber reinforced resin member comprising reinforcing fibers and a thermosetting resin and a metal member, and the core layer is selected from a thermoplastic resin, a foam, and a porous base material comprising discontinuous fibers and a thermoplastic resin, the board (A) and the member (B) include a region overlapping via the injection molded bonding resin (C), and
the overlapping region is formed by disposing the member (B) to overlap in parallel under the board (A) via the bonding resin (C),
wherein a thermoplastic resin layer (D) is further provided on an outer surface of the board (A), and the board (A) and the injection molded bonding resin (C) are bonded via the thermoplastic resin layer (D).
