Recess or through-hole forming method and electrode forming method
AssigneeDisco Corporation
InventorsKazuma Sekiya, Naoki Murazawa
Life of this patent
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Abstract
A recess or through-hole forming method for forming a substrate with a recess or a through-hole along a thickness direction of the substrate, the method including: a modified region forming step of applying a laser beam of such a wavelength as to be transmitted through the substrate to the substrate, with a focal region of the laser beam positioned inside the substrate, to form a column-shaped modified region which is exposed to a surface of the substrate and extends along the thickness direction of the substrate; and an etching step of etching the modified region to form the substrate with the recess or the through-hole, after the modified region forming step is performed.
Claims6
A recess or through-hole forming method for forming a substrate with a recess or a through-hole along a thickness direction of the substrate, the recess or through-hole forming method comprising:
- a modified region forming step of applying a laser beam of such a wavelength as to be transmitted through the substrate, to the substrate, with a focal region of the laser beam positioned inside the substrate, to form a hole exposed at least at one surface of the substrate and extending in the thickness direction of the substrate, and a modified region surrounding said hole;
- and
- an etching step of etching the modified region to form the recess or the through-hole in the substrate, after the modified region forming step is performed.
An electrode forming method for forming a substrate with a recess or a through-hole along a thickness direction of the substrate and forming an electrode in the recess or the through-hole, the electrode forming method comprising:
- a modified region forming step of applying a laser beam of such a wavelength as to be transmitted through the substrate to the substrate, with a focal region of the laser beam positioned inside the substrate, to form a hole exposed at least at one surface of the substrate and extending in the thickness direction of the substrate, and a modified region surrounding said hole;
- an etching step of etching the modified region to form the substrate with the recess or the through-hole, after the modified region forming step is performed;
- and
- an electrode forming step of filling the recess or the through-hole with a conductive member to form the substrate with the electrode along the thickness direction of the substrate, after the etching step is performed.
Dependencies are inferred from the claim text.