Ultrasonic bonding machine

An ultrasonic bonding machine comprising:

• a horn provided with a chip for bonding located at a bottom of the horn;
• a vibrator which horizontally vibrates the horn;
• an elevator which raises and lowers the horn;
• an anvil arranged below the horn and allowing two bonding targets to be placed thereon, with the two bonding targets overlapping each other;
• and
• a chip position changer configured, via rotation of the horn, for changing a position of the chip to a position at a top of the horn,
• wherein:
• the vibrator vibrates the horn and the elevator lowers the horn, so that the anvil and the vibrating chip sandwich, and ultrasonically bond, the bonding targets,
• a deposit remover is provided above the horn,
• when the horn is vibrated by the vibrator and raised by the elevator, the chip, positioned at the top of the horn by the chip position changer, comes into contact with the deposit remover, with the chip being vibrated to allow the deposit remover to remove a deposit adhering to the chip,
• the horn is configured to move to:
• a contact position at which the horn comes into contact with the bonding targets, a switching position at which a position of the chip is switched, and a deposit removal position at which the horn comes into contact with the deposit remover,
• the horn is located in the switching position when raised from the contact position, and
• the horn is located in the deposit removal position when raised from the switching position.