Electronic device with a heat dissipating function and heat dissipating module thereof

An electronic device with a heat dissipating function, the electronic device comprising:

• an outer case, a disposing space being formed inside the outer case;
• a heat generating component disposed inside the disposing space;
• and
• a heat dissipating module disposed inside the disposing space and located between the outer case and the heat generating component, the heat dissipating module comprising:
• a heat conducting assembly comprising:
• at least one first heat conducting component, a first portion of the at least one first heat conducting component away from the heat generating component being fixed on the outer case, a second portion of the at least one first heat conducting component adjacent to the heat generating component being movable relative to the outer case for moving toward or away from the outer case;
• and
• at least one second heat conducting component connected to the second portion of the at least one first heat conducting component and for abutting against the heat generating component to conduct heat generated by the heat generating component to the at least one first heat conducting component;
• wherein the first portion of the at least one first heat conducting component defines a first heat conducting portion of the heat conducting assembly, a combination of the second portion of the at least one first heat conducting component and the at least one second heat conducting component defines a second heat conducting portion of the heat conducting assembly, the first heat conducting portion is fixed on the outer case and connected to the outer case, the second heat conducting portion is connected to the first heat conducting portion and for abutting against the heat generating component, the second heat conducting portion is movable relative to the outer case for moving toward or away from the outer case, and the heat conducting assembly is resiliently deformed to apply a force on the heat generating component in a contacting manner when the heat generating component pushes the second heat conducting portion of the heat conducting assembly to move toward the outer case.