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AssigneeAsahi Kasei Kabushiki Kaisha
InventorsMasato Saito, Toru Yumoto, Masanori Tsuruta
Estimating the term…
Provided is a structure that has highly reliable electroconductive pattern regions, that offers an extremely simple manufacturing process, and that has excellent electrical insulation between the electroconductive pattern regions. This structure (10) having electroconductive pattern regions is provided with a support (11), and, on a surface configured by the support, a layer (14) in which insulation regions (12) containing a copper oxide- and phosphorus-containing organic substance and electroconductive pattern regions (13) containing copper are disposed next to one another. This stack is provided with: a support, a coating layer containing copper oxide and phosphorus and disposed on a surface configured by the support; and a resin layer disposed so as to cover the coating layer.
A structure comprising a support and a layer arranged on a surface constituted by the support, wherein an insulation region including copper oxide and phosphorus is arranged between conductive pattern regions including copper in the layer.
A structure comprising a support and a layer arranged on a surface constituted by the support, wherein an insulation region including copper oxide, and hydrazine or hydrazine hydrate is arranged between conductive pattern regions including copper in the layer.
A stack comprising a support, a coating layer, which is arranged on a surface constituted by the support and which includes copper oxide and phosphorus, and an oxygen barrier layer arranged so as to cover the coating layer,
A stack comprising a support, a coating layer, which is arranged on a surface constituted by the support and which includes copper oxide, and hydrazine or hydrazine hydrate, and an oxygen barrier layer arranged so as to cover the coating layer,
Copper wiring comprising reduced copper, which is obtained by reducing copper oxide, phosphorus, and carbon, wherein the elemental concentration ratio of phosphorus to copper is 0.02 to 0.30, and the elemental concentration ratio of carbon to copper is 1.0 to 6.0.
A method for the production of a structure, comprising the steps of:
A method for the production of a structure, comprising the steps of:
A method for the production of a structure, comprising the steps of:
A method for the production of a stack, comprising the steps of:
A method for the production of a stack, comprising the steps of:
A method for the production of a stack, comprising the steps of:
A method for the production of a structure, comprising the steps of:
Dependencies are inferred from the claim text.