Back to results
US 11,109,491 B2Granted
Wiring substrate and method of manufacturing the wiring substrate
AssigneeSeiko Epson Corporation
InventorYutaka Yamazaki
Life of this patent
Estimating the term…
Abstract
A wiring substrate includes a substrate containing a resin as a main component and including a mixed layer in which the resin and a catalyst are mixed together; and a metal wire disposed to cover the mixed layer and being in contact with the catalyst. The wiring substrate with such a configuration can increase the adhesion of the metal wire to the substrate.
Claims2
A wiring substrate including a substrate containing a resin as a main component, comprising:
- a flat part where a surface of the substrate is flat;
- an irradiated resin part, the irradiated resin part being a location of the substrate where the resin of the substrate has unevenness after the resin has been irradiated;
- and
- a metal wire provided on and corresponding to the location where the resin has unevenness,
- wherein the irradiated resin part is provided with a mixed layer in which the resin and catalyst particles are mixed together, the mixed layer being embedded with the catalyst particles covered by the resin of the substrate,
- the catalyst particles are not provided in the flat part of the substrate, and
- the metal wire is provided on and corresponds to the mixed layer, the metal layer being provided in contact with the resin and the catalyst particles.
4 more elements
Dependencies are inferred from the claim text.