High-speed, flexible integrated circuits and methods for making high-speed, flexible integrated circuits
AssigneeWisconsin Alumni Research Foundation
InventorsZhenqiang Ma, Guoxuan Qin, Namki Cho
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Abstract
The present invention provides flexible devices, such as integrated circuits, having a multilevel electronic device structure including two or more electronic components. The electronic components within the structure are electrically connected by an interconnect structure having multiple interconnect levels. In addition to the multilevel electronic device structure, the flexible devices include an elastomeric material disposed around the interconnect levels, including within the spaces between the interconnect levels.
Claims7
A method for fabricating a flexible device from a rigid device comprising:
- a multilevel electronic device structure comprising at least two electronic components electrically connected by an electrical interconnect structure having multiple interconnect levels along the vertical axis of the device;
- and a rigid dielectric material disposed around the electrical interconnect structure, including within spaces between the interconnect levels, the method comprising:
- (a) removing the rigid dielectric material to expose the electrical interconnect structure;
- (b) backfilling the resulting spaces between the interconnect levels with a liquid elastomeric dielectric precursor;
- and
- (c) curing the liquid elastomeric dielectric precursor to form an elastomeric dielectric material between the interconnect levels.
Dependencies are inferred from the claim text.