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US 11,109,483 B2Granted
Circuit board and electronic device including same
AssigneeSamsung Electronics Co., Ltd.
InventorShinho Kim
Life of this patent
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Abstract
An example circuit board includes a plurality of dielectric layers having a plurality of pattern holes; and a plurality of transmission lines formed in the plurality of dielectric layers, and coupled according to the plurality of pattern holes so as to form a plurality of patterns, wherein, when a current is applied to each of the plurality of transmission lines, magnetic flux can be generated in the plurality of patterns.
Claims12
A circuit board comprising:
- a plurality of stacked dielectric layers having a plurality of first pattern holes and a plurality of second pattern holes;
- a plurality of first power transmission lines formed in the plurality of dielectric layers, and coupled along the plurality of first pattern holes to form a plurality of first patterns;
- and
- a plurality of second power transmission lines formed in the plurality of dielectric layers, and coupled along the plurality of second pattern holes to form a plurality of second patterns,
- wherein magnetic fluxes are generated in the plurality of first patterns and the plurality of second patterns when a current is applied to each of the plurality of first power transmission lines and the plurality of second power transmission lines,
- wherein the plurality of dielectric layers further comprises a plurality of closed loop patterns surrounding insides of the plurality of first patterns and insides of the plurality of second patterns while passing through the plurality of first patterns and the plurality of second patterns, and
- wherein the plurality of closed loop patterns comprise ring-shaped coils.
4 more elements
An electronic device comprising:
- a housing comprising a first surface, a second surface facing an opposite direction of the first surface, and side surfaces surrounding a space between the first surface and the second surface;
- and
- a circuit board disposed in an interior of the housing,
- wherein the circuit board comprises:
- a plurality of stacked dielectric layers having a plurality of first pattern holes and a plurality of second pattern holes;
- a plurality of first power transmission lines formed in the plurality of dielectric layers, and coupled along the plurality of first pattern holes to form a plurality of first patterns;
- and
- a plurality of second power transmission lines formed in the plurality of dielectric layers, and coupled along the plurality of second pattern holes to form a plurality of second patterns, and
- wherein magnetic fluxes are generated in the plurality of first patterns and the plurality of second patterns when a current is applied to each of the plurality of first power transmission lines and the plurality of second power transmission lines,
- wherein the plurality of dielectric layers further comprises a plurality of closed loop patterns surrounding insides of the plurality of first patterns and insides of the plurality of second patterns while passing through the plurality of first patterns and the plurality of second patterns, and
- wherein the plurality of closed loop patterns comprise ring-shaped coils.
8 more elements
Dependencies are inferred from the claim text.