Vertically integrated circuit assembly

A vertically integrated circuit assembly, comprising:

• a substrate including a plurality of electrical traces;
• a first circuit assembly layer disposed on the substrate, the first circuit assembly layer including:
• a first set of integrated circuit components;
• and
• a plurality of electrical interconnects configured to route signals through the first circuit assembly layer, wherein the plurality of electrical interconnects form an electrical interconnect arrangement on a top surface of the first circuit assembly layer;
• and
• a second circuit assembly layer coupled to the top surface of the first circuit assembly layer, the second circuit assembly layer including:
• a second set of integrated circuit components;
• and
• a plurality of electrical interconnects configured to route signals through the second circuit assembly layer, the plurality of electrical interconnects forming an electrical interconnect arrangement on a bottom surface of the second circuit assembly layer configured to interface with the electrical interconnect arrangement on the top surface of the first circuit assembly layer, wherein the first set of integrated circuit components are configured to receive an input signal via a first electrical trace of the plurality of electrical traces, and transmit a first output signal via a second electrical trace of the plurality of electrical traces, the second set of integrated circuit components are configured to receive the input signal via a first electrical interconnect of the first circuit assembly layer, and transmit a second output signal via a second electrical interconnect of the first circuit assembly layer to a third electrical trace of the plurality of electrical traces, the first output signal includes a first bandwidth, and the second output signal includes a second bandwidth different from the first bandwidth.