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US 11,108,153 B2Granted
Antenna systems and devices and methods of manufacture thereof
OwnerUriel Weinstein, Assaf Bernsteininventors
Life of this patent
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Abstract
Embodiments of the present disclosure provide methods, apparatuses, devices and systems related to the implementation of a multi-layer printed circuit board (PCB) radio-frequency antenna featuring, a printed radiating element coupled to an absorbing element embedded in the PCB. The embedded element is configured within the PCB layers to prevent out-of-phase reflections to the bore-sight direction.
Claims21
A medical device radio-frequency (RF) antenna structure comprising:
- a printed circuit board (PCB) comprising a plurality of layers;
- at least one RF antenna comprising a radiating element and a metallic reflector backing the radiating element;
- an embedded absorbing material disposed within one or more layers internal to the PCB and arranged between the radiating element and the metallic reflector,
- and
- an electronic circuit disposed on the PCB,
- wherein:
- the electronic circuit is in electrical communication with the at least one RF antenna through one or more of a via and a transmission line in a layer of the PCB;
- the at least one RF antenna disposed within at least one external layer of the PCB;
- and
- the absorbing material is configured to absorb back-lobe radiation from the radiating element.
7 more elements
A medical device radio-frequency (RF) antenna structure comprising:
- a printed circuit board (PCB) comprising a plurality of layers;
- a transmitting RF antenna comprising a radiating element and a metallic reflector backing the radiating element;
- a receiving RF antenna;
- an embedded absorbing material disposed within at least one internal layer of the PCB and arranged between the radiating element and the metallic reflector,
- and
- an electronic circuit disposed on the PCB,
- wherein:
- the transmitting RF antenna and the receiving RF antenna are disposed within at least one external layer of the PCB,
- the absorbing material is configured to absorb back-lobe radiation from the radiating element, and
- the electronic circuit is in electrical communication with the receiving RF antenna and transmitting RF antennas through one or more of a via and a transmission line in a layer of the PCB.
7 more elements
Dependencies are inferred from the claim text.