Semiconductor device package and method of manufacturing the same

A semiconductor device package, comprising:

• a substrate having a first surface and a second surface opposite to the first surface;
• a first antenna disposed over the first surface of the substrate;
• and
• a second antenna disposed over the first surface of the substrate,
• wherein the first antenna and the second antenna are arranged on a same plane, and
• wherein a range of operating frequency of the first antenna is different from a range of operating frequency of the second antenna.

A semiconductor device package, comprising:

• a substrate having a first surface and a second surface opposite to the first surface;
• a first antenna disposed over the first surface of the substrate, the first antenna having a first port configured to generate a magnetic field;
• and
• a second antenna disposed over the first surface of the substrate,
• wherein the first antenna and the second antenna are arranged on a same plane;
• wherein a projection of a lateral surface of the first antenna adjacent to the first port is spaced apart from the second antenna, and
• wherein a bandwidth of a wave generated by the first antenna is different from a bandwidth of a wave generated by the second antenna.