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US 11,108,128 B2Granted
Circuit board for HF applications including an integrated broadband antenna
AssigneeAirbus Defence and Space GmbH
InventorsVolker Ziegler, Enric Miralles Navarro
Life of this patent
Estimating the term…
Abstract
A circuit board includes a substantially planar component carrier and a microstrip which is applied to a surface of the component carrier. The microstrip extends towards a connection transition which is arranged on a lateral edge of the component carrier. A waveguide portion of an antenna element which is produced by a 3D printing process is coupled to this connection transition.
Claims18
A circuit board comprising:
- a substantially planar component carrier;
- a microstrip applied to a surface of the component carrier and extending towards a connection transition, which is arranged on a lateral edge of the component carrier;
- and
- an antenna element produced by a 3D printing process and comprising a waveguide portion with a rectangular hollow cross section, which is coupled to the connection transition of the component carrier.
1 more element
A production method for a circuit board, the method comprising:
- generatively manufacturing an antenna element comprising a waveguide portion and a beam funnel portion by a 3D printing process, the waveguide portion having a rectangular hollow cross section;
- connecting the antenna element to a substantially planar component carrier;
- applying a microstrip to a surface of the component carrier which extends towards a connection transition which is arranged on a lateral edge of the component carrier;
- and
- coupling the antenna element to the waveguide portion at the connection transition of the component carrier.
2 more elements
A circuit board comprising:
- an antenna element which is produced by a 3D printing process and comprises a waveguide portion with a rectangular hollow cross section and a substantially planar component carrier portion which is formed integrally with the waveguide portion;
- and
- a microstrip which is applied to a surface of the component carrier portion and which extends towards a connection transition which is arranged on a lateral edge of the component carrier portion.
A production method for a circuit board, the method comprising:
- generatively manufacturing an antenna element comprising a waveguide portion with a rectangular hollow cross section, a substantially planar component carrier portion which is formed integrally with the waveguide portion, and a beam funnel portion by a 3D printing process;
- and
- applying a microstrip to a surface of the component carrier portion which extends towards a connection transition which is arranged on a lateral edge of the component carrier portion.
Dependencies are inferred from the claim text.