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US 11,108,012 B2Granted
Display panel, display apparatus, method of detecting crack in sealant layer of display panel, and method of fabricating display panel
AssigneesBoe Technology Group Co., Ltd., Chengdu Boe Optoelectronics Technology Co., Ltd.
InventorsZhenli Zhou, Zhiliang Jiang, Yinan Liang
Life of this patent
Estimating the term…
Abstract
The present application discloses a display panel. The display panel includes a first substrate; a second substrate facing the first substrate; a sealant layer between the first substrate and the second substrate sealing the first substrate and the second substrate together to form a cell; and a first conductive line layer having a first continuous conductive line configured to detect crack in the sealant layer. The first conductive line layer is in contact with the sealant layer.
Claims17
A display panel, comprising:
- a first substrate;
- a second substrate facing the first substrate;
- a sealant layer between the first substrate and the second substrate sealing the first substrate and the second substrate together to form a cell;
- a first conductive line layer comprising a first continuous conductive line configured to detect crack in the sealant layer;
- a second conductive line layer comprising a second continuous conductive line configured to detect crack in the display panel;
- two lead wires respectively connecting two terminals of the first conductive line layer to the second conductive line layer;
- and
- two bonding leads in a driver integrated circuit bonding area, the two bonding leads electrically connected to the second conductive line layer;
- wherein the first conductive line layer is in contact with the sealant layer;
- the second conductive line layer is in a peripheral area of the display panel;
- an orthographic projection of the sealant layer on the first substrate is substantially non-overlapping with an orthographic projection of the second conductive line layer on the first substrate;
- and
- the first conductive line layer is electrically connected to the two bonding leads sequentially through the two lead wires and the second conductive line layer.
10 more elements
A substrate, comprising:
- a sealant layer;
- and
- a first conductive line layer comprising a first continuous conductive line configured to detect crack in the sealant layer;
- a second conductive line layer comprising a second continuous conductive line configured to detect crack in the substrate;
- two lead wires respectively connecting two terminals of the first conductive line layer to the second conductive line layer;
- and
- two bonding leads in a driver integrated circuit bonding area, the two bonding leads electrically connected to the second conductive line layer;
- wherein the first conductive line layer is in contact with the sealant layer;
- the second conductive line layer is in a peripheral area of the substrate;
- an orthographic projection of the sealant layer on a base substrate of the substrate is substantially non-overlapping with an orthographic projection of the second conductive line layer on the base substrate;
- and
- the first conductive line layer is electrically connected to the two bonding leads sequentially through the two lead wires and the second conductive line layer.
9 more elements
A method of fabricating a display panel, comprising:
- forming a first substrate;
- forming a second substrate;
- forming a sealant material layer on the second substrate, the sealant material layer being formed in a peripheral area of the second substrate and enclosing a display area of the second substrate;
- forming a first conductive line layer comprising a first continuous conductive line on the first substrate, the first conductive line layer being formed in a peripheral area of the first substrate and encircling a first area of the first substrate;
- forming a second conductive line layer comprising a second continuous conductive line configured to detect crack in the display panel;
- forming two lead wires respectively connecting two terminals of the first conductive line layer to the second conductive line layer;
- and
- forming two bonding leads in a driver integrated circuit bonding area, the two bonding leads electrically connected to the second conductive line layer;
- and
- assembling the first substrate and the second substrate in a cell by adhering the sealant material layer onto the first substrate, thereby forming a sealant layer sealing a display area of the display panel;
- wherein the first conductive line layer is formed to be in contact with the sealant layer;
- the second conductive line layer is in a peripheral area of the display panel;
- an orthographic projection of the sealant layer on the first substrate is substantially non-overlapping with an orthographic projection of the second conductive line layer on the first substrate;
- and
- the first conductive line layer is electrically connected to the two bonding leads sequentially through the two lead wires and the second conductive line layer.
12 more elements
Dependencies are inferred from the claim text.