UV LED array with power interconnect and heat sink

A combined interconnect and heat sink for high power devices, comprising:

• a first substrate selected from an electrically insulating material or an electrically conductive material with one or more electrically-insulating layers positioned thereon;
• a first circuit disposed on a surface of the first substrate;
• a high heat-generating device selected from a device that uses current of 1 amp or more or a device that generates heat of greater than approximately 30 Watts/cm2, the high-heat generating device selected from one or more of a UV LED, a visible LED, a laser, or a thin film heater positioned on a portion of the first circuit or on the surface of the first substrate and electrically communicating with the first circuit;
• a second substrate selected from an electrically insulating material or an electrically conductive material with one or more electrically-insulating layers positioned thereon spaced apart from the first substrate;
• a second circuit disposed on a surface of the second substrate;
• a heat sink configured to dissipate heat from the high heat-generating device;
• the heat sink positioned adjacent to at least the first substrate or the second substrate;
• an aperture passing through each of the first substrate, the second substrate, and the heat sink;
• an electrical insulator lining the aperture;
• an electrically and thermally conductive liner positioned adjacent to the electrical insulator;
• a fastener positioned in the aperture and contacting the electrically and thermally conductive liner and wherein the fastener electrically interconnects the first circuit and the second circuit through the electrically and thermally conductive liner and electrically communicates with an external power supply, carrying one or more of power or an electrical signal, and dissipates heat through the electrically and thermally conductive liner to the heat sink.