Method of producing optoelectronic semiconductor components

A method of producing an optoelectronic semiconductor component comprising:

• A) providing a chip carrier with electrical conductor structures on a carrier upper side,
• B) applying at least one semiconductor chip configured to produce light on at least one of the electrical conductor structures,
• C) applying at least one sealing structure to at least one of the electrical conductor structures so that the sealing structure completely surrounds at least one contact area when viewed from the top, and
• D) producing a mold body directly at the at least one semiconductor chip and directly at the at least one sealing structure by transfer molding or injection molding,
• wherein, in an injection mold, the at least one sealing structure seals the at least one contact area against a material of the mold body so that the at least one contact area remains free of the mold body,
• the electrical conductor structures are electrical conductor tracks and also electrical contact surfaces, and
• the contact area comprises at least two of the electrical contact surfaces that are configured for external electrical contacting of the finished semiconductor component.