Component with end-side mounted light emitting semiconductor chip

A component comprising a light emitting semiconductor chip, wherein

• the semiconductor chip comprises a layer arrangement comprising a plurality of layers comprising at least one p-conducting layer and one n-conducting layer,
• the p-conducting layer and the n-conducting layer adjoin one another in an active zone,
• the active zone is arranged in a first plane,
• the p-conducting layer and the n-conducting layer are arranged parallel to the first plane,
• the p-conducting layer and the n-conducting layer are arranged at opposite sides with respect to the first plane,
• a first electrical contact is configured on the p-conducting side of the layer arrangement at a first side of the layer arrangement of the semiconductor chip,
• a second electrical contact is configured on the n-conducting side of the layer arrangement at a second side of the semiconductor chip, said second side being situated opposite the first side of the semiconductor chip with respect to the active zone,
• the first side and the second side are arranged at opposite sides with respect to the first plane of the active zone, wherein the first plane is between the first and the second side,
• the semiconductor chip comprises side faces arranged between the first side and the second side, wherein the side faces are arranged transversely to the first plane of the active zone,
• one of the side faces is an end side of the semiconductor chip,
• a substrate with a top side arranged transversely to the first plane of the active zone,
• the first side of the semiconductor chip transitions into the second side via the end side,
• the semiconductor chip is secured by the end side on the top side of the substrate,
• the substrate comprises a first and second further electrical contact, and
• the further electrical contacts electrically conductively connect to the electrical contacts of the semiconductor chip.