Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsTetsuro Hayashida, Takuma Nanjo, Tatsuro Watahiki
Life of this patent
Estimating the term…
Loading patent…
AssigneeMitsubishi Electric Corporation
InventorsTetsuro Hayashida, Takuma Nanjo, Tatsuro Watahiki
Estimating the term…
A semiconductor device includes a supporting substrate, a first GaN layer of a first conductivity type provided on the side of a first main surface of the supporting substrate, a second GaN layer of the first conductivity type provided on the first GaN layer, an AlxGa1−xN layer provided on the second GaN layer, a third GaN layer of a second conductivity type provided on the AlxGa1−xN layer, a fourth GaN layer of the first conductivity type provided on the third GaN layer, an insulating film covering a top of the fourth GaN layer, a trench gate reaching the inside of the second GaN layer, a gate electrode, a first main electrode connected to the third GaN layer, and a second main electrode, and the donor concentration of the third GaN layer is lower than that of the fourth GaN layer.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.