IC package having a metal die for ESP protection
AssigneeNanya Technology Corporation
InventorsFang Wen Liu, Tseng-Fu Lu
Life of this patent
Estimating the term…
Abstract
An IC package having a metal die for ESD protection includes: a printed circuit board having power connections and ground connections; a function die; and a metal die adhered unto the function die and electrically insulated from the function die, wherein the metal die comprises a metal layer and a dummy die underlying the metal layer, and the metal layer is electrically coupled to one or more of the power connections and ground connections of the printed circuit board to provide package level electrostatic discharge (ESD) protection; and an encapsulant covering the metal die, the function die and a surface of the printed circuit board supporting the metal die and function die.
Claims14
An IC package having a metal die for ESD protection comprising:
- a printed circuit board having a plurality of power connections and ground connections;
- a function die having a first surface and a second surface opposite to the first surface and a plurality of conductive pads on the first surface;
- wherein the second surface of the function die is in contact with an upper surface of the printed circuit board, one or more of the conductive pads is electrically coupled to one or more of the power connections and ground connections of the printed circuit board;
- a metal die over the first surface of the function die and electrically insulated from the function die, wherein the metal die comprises a metal layer and a dummy die underlying the metal layer, the dummy die is in contact with the first surface of the function die, and the metal layer is electrically coupled to one or more of the power connections and ground connections of the printed circuit board to provide package level electrostatic discharge (ESD) protection;
- and
- an encapsulant covering the metal die, the function die and the upper surface of the printed circuit board.
A method for manufacturing an IC package having a metal die for ESD protection comprising:
- providing a dummy die;
- forming a metal layer on a surface of the dummy die to provide a metal die;
- mounting the metal die unto a function die with the metal layer being exposed and let the metal die being electrically in isolation with the function die;
- disposing the function die unto an upper surface of a printed circuit board and electrically connecting the metal layer to one or more of power connections and ground connections of the printed circuit board;
- and
- forming an encapsulant covering the metal die, the function die and the upper surface of the printed circuit board.
Dependencies are inferred from the claim text.