Hybrid system including photonic and electronic integrated circuits and cooling plate

A method comprising:

• fusion-bonding a die stack to a semiconductor substrate, wherein:
• the die stack includes a photonic integrated circuit (PIC) die and an electronic integrated circuit (EIC) die;
• the PIC die includes a PIC substrate and a photonic integrated circuit formed on the PIC substrate;
• the EIC die includes an EIC substrate and an electronic integrated circuit formed on the EIC substrate;
• and
• the PIC substrate is bonded to the semiconductor substrate;
• bonding a printed circuit board (PCB) on the semiconductor substrate;
• wire-bonding solder pads on the PCB to the die stack;
• and
• bonding a cooling plate to the EIC substrate.

A device comprising:

• a cooling plate;
• and
• a die stack on the cooling plate, the die stack including:
• a photonic integrated circuit (PIC) die including a PIC substrate and a photonic integrated circuit formed on the PIC substrate;
• and
• an electronic integrated circuit (EIC) die including an EIC substrate and an electronic integrated circuit formed on the EIC substrate,
• wherein the EIC die and the PIC die are bonded such that the PIC substrate and the EIC substrate are disposed on opposing sides of the die stack;
• and
• wherein the EIC substrate is bonded to the cooling plate.