Semiconductor packages and methods of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Jing-Cheng Lin, Po-Hao Tsai
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Abstract
Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a method including forming a first die package, the first die package including a first die, a first electrical connector, and a first redistribution layer, the first redistribution layer being coupled to the first die and the first electrical connector, forming an underfill over the first die package, patterning the underfill to have an opening to expose a portion of the first electrical connector, and bonding a second die package to the first die package with a bonding structure, the bonding structure being coupled to the first electrical connector in the opening of the underfill.
Claims20
A package comprising:
- a first package comprising:
- a first die;
- and
- an encapsulant extending along sidewalls of the first die;
- a second package bonded to the first package, the second package comprising a second die bonded to a first surface of a first substrate;
- and
- a first underfill between the first package and the second package, the first underfill having a first opening between the first die and the first substrate, a width of the first opening being less than a width of the first die and a width of the second die, a portion of a second surface of the first substrate being exposed in the first opening, the second surface of the first substrate being opposite the first surface of the first substrate, wherein a portion of a surface of the first die is exposed in the first opening, the surface of the first die facing the second surface of the first substrate.
A package comprising:
- a first package comprising:
- a first die having an active surface and a backside surface opposite the active surface, the backside surface of the first die having a first width;
- a molding material surrounding the first die, a first surface of the molding material being level with the active surface of the first die, and a second surface of the molding material being level with the backside surface of the first die;
- and
- a redistribution layer coupled to the first die, the active surface of the first die being closer to the redistribution layer than the backside surface of the first die;
- a second package bonded to the first package, the second package comprising a second die attached to a first substrate;
- and
- a first underfill between the first package and the first substrate, a sidewall of the first underfill being coplanar with a sidewall of the molding material, the first underfill having a first opening exposing a portion of a first surface of the first substrate, the first surface of the first substrate facing the backside surface of the first die, the first opening having a second width less than the first width.
A package comprising:
- a first package comprising:
- a first die having an active surface and a backside surface opposite the active surface, the backside surface comprising a die attach film;
- a molding material surrounding the first die;
- and
- a first redistribution layer coupled to the first die, the active surface of the first die being interposed between the backside surface of the first die and the first redistribution layer;
- a second package bonded to the first package, the second package comprising a second die, the first die being interposed between the first redistribution layer and the second die;
- and
- an underfill between the first package and the second package, a sidewall of the underfill being coplanar with a sidewall of the first redistribution layer, the underfill having a first opening exposing a portion of the die attach film and a portion of a surface of the second package, the surface of the second package facing the die attach film, wherein a width of the first opening is less than a width of the first die and a width of the second die.
Dependencies are inferred from the claim text.