Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture

A semiconductor device comprising:

• an active surface and a plurality of die bond pad groups positioned at different regions of the active surface, wherein at least two of the plurality of die bond pad groups share a same set of pin assignments,
• wherein the semiconductor device is configured to selectively enable one of the at least two of the plurality of die bond pad groups and to disable another one of the at least two of the plurality of die bond pad groups.

A method of manufacturing a semiconductor device package, comprising:

• selectively connecting package contacts of the semiconductor device package to a semiconductor die forming a part of the semiconductor device package, wherein the semiconductor die includes a plurality of die bond pad groups each having dedicated pin assignments, wherein selectively connecting the package contacts includes—
• connecting individual package contacts to one of a plurality of subsets of the plurality of die bond pad groups, and
• programming the semiconductor die into one of a plurality of pad states, each of the plurality of pad states corresponding to a different one of the plurality of subsets being enabled for use.