Method of manufacturing semiconductor device

A method of manufacturing a semiconductor package, comprising:

• forming each of a plurality of semiconductor devices by:
• forming a semiconductor feature on a first surface of a substrate;
• forming a first insulating film above the semiconductor feature;
• forming a first wiring layer on the first insulating film;
• forming a second insulating film on the first wiring layer;
• forming a second wiring layer on the second insulating film;
• forming a first electrode on the second wiring layer;
• providing a protective adhesive that covers the first electrode and the second wiring layer;
• bonding a supporting substrate onto the protective adhesive;
• polishing a second surface of the substrate opposite to the first surface;
• removing the supporting substrate from the protective adhesive;
• and
• removing at least a portion of the protective adhesive to expose the first electrode;
• and
• stacking the plurality of the semiconductor devices.